Patent Assignment
Reel/Frame 022020/0346
Change of Assignee's Address
Recorded: 2008-12-23
Pages: 9
Assignor
NIPPON STEEL MATERIALS CO., LTD.
Executed: 2008-05-26
Assignee
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Property
(1)
Gold Wire for Semiconductor Element Connection
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 25, 2008
From: KIMURA, KEIICHI; UNO, TOMOHIRO; YAMADA, TAKASHI; NISHIBAYASHI, KAGEHITO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 021583/0366 →
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →