Patent Assignment
Reel/Frame 030126/0952
Assignment of Assignor's Interest
Recorded: 2013-04-01
Pages: 8
Assignors
UNO, TOMOHIRO
Executed: 2013-03-22
YAMADA, TAKASHI
Executed: 2013-03-22
IKEDA, ATSUO
Executed: 2013-03-22
Assignees
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1010021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 3580032, JAPAN
Covered Property
(1)
Bonding Structure of Multilayer Copper Bonding Wire
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →