Patent Assignment
Reel/Frame 021470/0775
Assignment of Assignor's Interest
Recorded: 2008-09-02
Pages: 4
Assignors
TANAKA, MASAMOTO
Executed: 2007-10-10
SASAKI, TSUTOMU
Executed: 2007-10-10
KOBAYASHI, TAKAYUKI
Executed: 2007-10-10
KAWAKAMI, KAZUTO
Executed: 2007-10-10
FUJISHIMA, MASAYOSHI
Executed: 2007-10-01
Assignees
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy, Solder Ball and Electronic Member, and Lead-Free Solder Alloy, Solder Ball and Electronic Member for Automobile-Mounted Electronic Member
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name
Mar 20, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 048646/0491 →
Change of Address
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0147 →