Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
View Patent ↗A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu 3 Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu 6 Sn 5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu 6 Sn 5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu 6 Sn 5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.
1. A lead-free solder alloy comprising:
1.0 to 2.0% by mass of Ag;
0.3 to 1.0% by mass of Cu;
0.005 to 0.10% by mass of Ni;
0.0001 to 0.005% by mass of Fe;
0.005 to 0.10% by mass of Co; and
a balance including Sn and unavoidable impurities,
wherein a content ratio of Ni, Co, Fe is 10:3 to 7:0.02 to 2, respectively, and
wherein a total content of Ni, Co and Fe is 0.0122% to 0.10% by mass.
2. The lead-free solder alloy according to claim 1 , wherein a concentration of oxygen contained is 0.0020% or less by mass.
3. The lead-free solder alloy according to claim 1 , further containing any one or both of 0.0005 to 0.0050% by mass of Cr and 0.0005 to 0.0050% by mass of V.
4. The lead-free solder alloy according to claim 1 , further containing 0.01 to 0.5% by mass of Sb.
5. The lead-free solder alloy according to claim 1 , further containing any one or both of 0.0005 to 0.005% by mass of P and 0.0005 to 0.01% by mass of Ge, wherein P+Ge is 0.01% or less by mass.
6. A solder ball comprising said lead-free solder alloy according to claim 1 .
7. An electronic member including a solder bump formed by using said lead-free solder alloy according to claim 1 .
8. The lead-free solder alloy for use as the automobile-mounted electronic member comprising said lead-free solder alloy according to claim 1 .
9. The lead-free solder alloy for use as the automobile-mounted electronic member according to claim 8 , wherein concentration of oxygen contained is 0.0020% or less by mass.
10. The lead-free solder alloy for use as the automobile-mounted electronic member according to claim 8 , further containing any one or both of 0.0005 to 0.0050% by mass of Cr and 0.0005 to 0.0050% by mass of V.
11. The lead-free solder alloy for use as the automobile-mounted electronic member according to claim 8 , further containing 0.01 to 0.5% by mass of Sb.
12. The lead-free solder alloy for use as the automobile-mounted electronic member according to claim 8 , further containing any one or both of 0.0005 to 0.005% by mass of P and 0.0005 to 0.01% by mass of Ge, wherein P+Ge is 0.01% or less by mass.
13. The solder ball for use as the automobile-mounted electronic member, comprising said lead-free solder alloy for an automobile-mounted electronic member according to claim 8 .
14. The automobile-mounted electronic member, comprising the solder bump formed by using said lead-free solder alloy for automobile-mounted electronic member according to claim 8 .
15. The lead-free solder alloy according to claim 4 , further containing any one or both of 0.0005 to 0.005% by mass of P and 0.0005 to 0.01% by mass of Ge, wherein P+Ge is 0.01% or less by mass.
16. The lead-free solder alloy for use as the automobile-mounted electronic member comprising said lead-free solder alloy according to claim 4 .
17. The solder ball for use as the automobile-mounted electronic member, comprising said lead-free solder alloy for the automobile-mounted electronic member according to claim 16 .
18. The automobile-mounted electronic member, comprising the solder bump formed by using said lead-free solder alloy for the automobile-mounted electronic member according to claim 16 .