IP Library › Assignment 049219/0448
Patent Assignment
Reel/Frame 049219/0448

Change of Name

Recorded: 2019-05-17 Pages: 20
Assignor
Assignee
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (2)
Bonding Structure of Bonding Wire
Patent: 9,331,049 →
Application: 12/866,797 →
Publication: US 2011/0104510
Copper Alloy Bonding Wire for Semiconductor
Patent: 9,427,830 →
Application: 13/380,123 →
Publication: US 2012/0094121
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 21, 2010
From: UNO, TOMOHIRO; YAMADA, TAKASHI; IKEDA, ATSUO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 025175/0020 →
Assignment of Assignor's Interest Dec 22, 2011
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; YAMADA, TAKASHI; ODA, DAIZO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027432/0533 →
Change of Name Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Change of Address Nov 4, 2015
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 037043/0474 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd. Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →