IP Library Assignment 054174/0502
Patent Assignment
Reel/Frame 054174/0502

Change of Address for Nippon Steel Chemical & Material Co., Ltd.

Recorded: 2020-10-21 Pages: 24
Assignor
Assignee
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
13-1, NIHONBASHI 1-CHOME, CHUO-KU, TOKYO, 103-0027, JAPAN
Covered Properties (22)
Bonding Structure of Bonding Wire
Patent: 9,331,049 →
Application: 12/866,797 →
Publication: US 2011/0104510
Copper Alloy Bonding Wire for Semiconductor
Patent: 9,427,830 →
Application: 13/380,123 →
Publication: US 2012/0094121
Bonding Wire for Semiconductor
Patent: 8,742,258 →
Application: 13/384,819 →
Publication: US 2012/0118610
Polymer for Use in Organic Electroluminescent Element and Organic Electroluminescent Element Employing Same
Application: 14/118,866 →
Publication: US 2014/0084279
Material for Organic Electroluminescent Elements, and Organic Electroluminescent Element Using Same
Application: 15/102,127 →
Publication: US 2016/0308130
Material for Organic Electroluminescent Elements, and Organic Electroluminescent Element Using Same
Application: 15/104,661 →
Publication: US 2016/0315262
Bonding Wire for Semiconductor Device
Application: 15/107,417 →
Publication: US 2017/0323864
Bonding Wire for Semiconductor Device
Application: 15/107,421 →
Publication: US 2017/0200689
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
Application: 15/107,423 →
Publication: US 2017/0117244
Bonding Wire for Semiconductor Device
Application: 15/107,427 →
Publication: US 2017/0200690
Bonding Wire for Semiconductor Device
Patent: 9,773,748 →
Application: 15/116,145 →
Publication: US 2017/0179064
Organic-Electroluminescent-Element Material and Organic Electroluminescent Elements Using Same
Application: 15/116,540 →
Publication: US 2016/0380199
Bonding Wire for Semiconductor Device
Application: 15/305,238 →
Publication: US 2017/0040281
Bonding Wire for Semiconductor Device
Patent: 9,887,172 →
Application: 15/305,584 →
Publication: US 2017/0194280
Polyurethane-Modified Epoxy Resin, Method for Producing Same, Epoxy Resin Composition and Cured Product
Application: 15/315,215 →
Publication: US 2017/0198085
Nickel Particle Composition, Bonding Material, and Bonding Method in Which Said Material Is Used
Application: 15/323,092 →
Publication: US 2017/0136585
Bonding Wire for Semiconductor Device
Application: 15/515,508 →
Publication: US 2017/0216974
Bonding Wire for Semiconductor Device
Application: 15/577,735 →
Publication: US 2018/0130763
Bonding Wire for Semiconductor Device
Application: 15/851,554 →
Publication: US 2018/0133843
Bonding Wire for Semiconductor Device
Application: 15/852,798 →
Publication: US 2018/0122765
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
Application: 16/248,531 →
Publication: US 2019/0164927
Copper Alloy Bonding Wire for Semiconductor Devices
Application: 16/311,125 →
Publication: US 2020/0312808
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 21, 2010
From: UNO, TOMOHIRO; YAMADA, TAKASHI; IKEDA, ATSUO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 025175/0020 →
Assignment of Assignor's Interest Dec 22, 2011
From: UNO, TOMOHIRO; TERASHIMA, SHINICHI; YAMADA, TAKASHI; ODA, DAIZO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027432/0533 →
Assignment of Assignor's Interest Jan 19, 2012
From: TERASHIMA, SHINICHI; UNO, TOMOHIRO; YAMADA, TAKASHI; ODA, DAIZO
To: NIPPON STEEL MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 027559/0066 →
Change of Name Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Assignment of Assignor's Interest Nov 19, 2013
From: TANAKA, HIROSHIGE; ASARI, TOHRU; SHIRAISHI, KAZUTO; SAKAI, MITSURU
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 031634/0908 →
Change of Address Nov 4, 2015
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 037043/0474 →
Assignment of Assignor's Interest Jun 6, 2016
From: OGAWA, JUNYA; TADA, MASASHI; UEDA, TOKIKO; KAI, TAKAHIRO
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 038819/0487 →
Assignment of Assignor's Interest Jun 16, 2016
From: OGAWA, JUNYA; TADA, MASASHI; UEDA, TOKIKO; KAI, TAKAHIRO
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 038932/0919 →
Assignment of Assignor's Interest Jun 23, 2016
From: YAMADA, TAKASHI; ODA, DAIZO; HAIBARA, TERUO; UNO, TOMOHIRO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 038995/0592 →
Assignment of Assignor's Interest Jun 23, 2016
From: YAMADA, TAKASHI; ODA, DAIZO; OISHI, RYO; UNO, TOMOHIRO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 038991/0007 →
Assignment of Assignor's Interest Jun 23, 2016
From: ODA, DAIZO; ETO, MOTOKI; YAMADA, TAKASHI; HAIBARA, TERUO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 038991/0107 →
Assignment of Assignor's Interest Aug 4, 2016
From: OGAWA, JUNYA; KAI, TAKAHIRO; UEDA, TOKIKO; TADA, MASASHI
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 039344/0037 →
Assignment of Assignor's Interest Aug 4, 2016
From: YAMADA, TAKASHI; ODA, DAIZO; OISHI, RYO; UNO, TOMOHIRO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 039347/0430 →
Assignment of Assignor's Interest Oct 17, 2016
From: OYAMADA, TETSUYA; UNO, TOMOHIRO; DEAI, HIROYUKI
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 040032/0644 →
Corrective Assignment to Correct the Application Number 15/295,273 Number Should Be 15305238 Previously Recorded on Reel 040032 Frame 0644. Assignor(S) Hereby Confirms the Assignment. Oct 21, 2016
From: OYAMADA, TETSUYA; UNO, TOMOHIRO; DEAI, HIROYUKI
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 040449/0898 →
Assignment of Assignor's Interest Oct 21, 2016
From: ODA, DAIZO; ETO, MOTOKI; SAITO, KAZUYUKI; HAIBARA, TERUO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 040087/0312 →
Assignment of Assignor's Interest Dec 1, 2016
From: YAMADA, EISUKE; YOKOYAMA, NAOKI; KUNITAKE, TOHRU
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 040482/0348 →
Assignment of Assignor's Interest Jan 3, 2017
From: SHIMIZU, TAKAYUKI
To: NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
Reel/Frame 040833/0376 →
Assignment of Assignor's Interest Mar 29, 2017
From: YAMADA, TAKASHI; ODA, DAIZO; HAIBARA, TERUO; OISHI, RYO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 041788/0390 →
Assignment of Assignor's Interest May 11, 2017
From: YAMADA, TAKASHI; ODA, DAIZO; HAIBARA, TERUO; OISHI, RYO
To: NIPPON MICROMETAL CORPORATION; NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 042344/0425 →
Change of Name Dec 18, 2018
From: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 047805/0595 →
Change of Name Dec 24, 2018
From: NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 047980/0416 →
Merger and Change of Name May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Name May 17, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049219/0448 →