Patent Assignment
Reel/Frame 040032/0644
Assignment of Assignor's Interest
Recorded: 2016-10-17
Pages: 5
Assignors
OYAMADA, TETSUYA
Executed: 2016-10-04
UNO, TOMOHIRO
Executed: 2016-10-04
DEAI, HIROYUKI
Executed: 2016-10-04
Assignees
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 104-0061, JAPAN
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Application Number 15/295,273 Number Should Be 15305238 Previously Recorded on Reel 040032 Frame 0644. Assignor(S) Hereby Confirms the Assignment.
Oct 21, 2016
From: OYAMADA, TETSUYA; UNO, TOMOHIRO; DEAI, HIROYUKI
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON MICROMETAL CORPORATION
Reel/Frame 040449/0898 →
Merger and Change of Name
May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →