Patent Assignment
Reel/Frame 042344/0425
Assignment of Assignor's Interest
Recorded: 2017-05-11
Pages: 8
Assignors
YAMADA, TAKASHI
Executed: 2016-05-20
ODA, DAIZO
Executed: 2016-05-19
HAIBARA, TERUO
Executed: 2016-05-19
OISHI, RYO
Executed: 2016-05-20
SAITO, KAZUYUKI
Executed: 2016-05-20
UNO, TOMOHIRO
Executed: 2016-05-26
Assignees
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 104-0061, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →