Patent Assignment
Reel/Frame 027559/0066
Assignment of Assignor's Interest
Recorded: 2012-01-19
Pages: 5
Assignors
TERASHIMA, SHINICHI
Executed: 2011-12-27
UNO, TOMOHIRO
Executed: 2011-12-27
YAMADA, TAKASHI
Executed: 2011-12-27
ODA, DAIZO
Executed: 2011-12-27
Assignees
NIPPON STEEL MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU,, TOKYO, 1010021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1, OAZA SAYAMAGAHARA, IRUMA-SHI,, SAITAMA, 3580032, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 10, 2012
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 029434/0177 →
Merger and Change of Name
May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049837/0872 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Oct 21, 2020
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 054174/0502 →