IP Library Assignment 022046/0932
Patent Assignment
Reel/Frame 022046/0932

Assignment of Assignor's Interest

Recorded: 2008-12-31 Pages: 2
Assignor
CHEN, MING-FA
Executed: 2008-12-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Through-Silicon via with Air Gap
Patent: 7,910,473 →
Application: 12/347,745 →
Publication: US 2010/0164117