Patent Assignment
Reel/Frame 022054/0359
Assignment of Assignor's Interest
Recorded: 2009-01-05
Pages: 4
Assignors
JUNG, YOUNG HY
Executed: 2008-12-23
OH, JAE SUNG
Executed: 2008-12-23
MOON, KI IL
Executed: 2008-12-23
KIM, KI CHAE
Executed: 2008-12-23
LEE, CHAN SUN
Executed: 2008-12-23
GWON, JIN HO
Executed: 2008-12-23
CHOI, JAE YOUN
Executed: 2008-12-23
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate for Semiconductor Package Having a Reinforcing Member That Prevents Distortions and Method for Fabricating the Same