Patent Assignment
Reel/Frame 022057/0370
Assignment of Assignor's Interest
Recorded: 2009-01-05
Pages: 4
Assignee
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
GATE CITY OSAKI TOWER 8F, 11-2 OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Thermocompression Bonding Head and Mounting Device Using the Same
Application:
12/303,019 →
Publication:
US 2009/0126877
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.