THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME
The present invention provides a thermocompression bonding head capable of mounting an electric component on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head 3 includes a heatable metal head body 5 having an elastic pressure-bonding member 7 made of elastomer and a metal pressing member 5 b . The metal pressing member 5 b , corresponding to an electric component 20 as a target to be bonded with pressure, is provided as a united body with the head body 5 , and the elastic pressure-bonding member 7 is attached to the head body 5 such that a pressing surface 50 of the metal pressing member 5 b is exposed in a recessed state on the periphery of the metal pressing member 5 b . The head body 5 is made of a frame-shaped member having a concave portion 5 a , and the metal pressing member 5 b is integrally formed in the concave portion 5 a of the head body 5 . Further, the elastic pressure-bonding member 7 is housed and attached in the concave portion 5 a.
1 . A thermocompression bonding head comprising:
a head body, made of heatable metal, having an elastic pressure-bonding member made of elastomer; and
a metal pressing member, corresponding to an electric component as a target to be bonded with pressure, provided as a united body with the head body,
wherein the elastic pressure-bonding member is attached to the head body such that a pressing surface of the metal pressing member is exposed in a recessed state on a periphery of the metal pressing member.
2 . The thermocompression bonding head according to claim 1 , wherein the head body is made of a frame-shaped member having a housing portion of a concave shape,
wherein the metal pressing member is integrally formed in the housing portion of the head body, and
wherein the elastic pressure-bonding member is housed in the housing portion.
3 . The thermocompression bonding head according to claim 1 , wherein a size of the pressing surface of the metal pressing member is arranged to be slightly smaller than a size of a pressed surface of the electric component.
4 . The thermocompression bonding head according to claim 1 , wherein a height difference between the pressing surface of the metal pressing member and a surface of the elastic pressure-bonding member is arranged to be greater than a thickness of the electric component.
5 . The thermocompression bonding head according to claim 1 , wherein a portion on the periphery of the metal pressing member of the elastic pressure-bonding member is formed in a taper shape toward an outward of an opening of the metal pressing member.
6 . A mounting device comprising:
a base placeable a wiring board thereon; and
a thermocompression bonding head disposed opposite to the base, the thermocompression bonding head including:
a head body, made of heatable metal, having an elastic pressure-bonding member made of elastomer; and
a metal pressing member, corresponding to an electric component as a target to be bonded with pressure, provided as a united body with the head body, the elastic pressure-bonding member being attached to the head body such that a pressing surface of the metal pressing member is exposed in a recessed state on a periphery of the metal pressing member,
wherein the thermocompression bonding head is pressed with prescribed pressure with respect to the electric component placed on the wiring board on the base.
7 . The mounting device according to claim 6 , wherein the head body of the thermocompression bonding head is made of a frame-shaped member having a housing portion of a concave shape,
wherein the metal pressing member is integrally formed in the housing portion of the head body, and
wherein the elastic pressure-bonding member is housed in the housing portion.
8 . The mounting device according to claim 6 , wherein a size of the pressing surface of the metal pressing member of the thermocompression bonding head is arranged to be slightly smaller than a size of a pressed surface of the electric component.
9 . The mounting device according to claim 6 , wherein a height difference between the pressing surface of the metal pressing member and a surface of the elastic pressure-bonding member of the thermocompression bonding head is arranged to be greater than a thickness of the electric component.
10 . The mounting device according to claim 6 , wherein a portion on the periphery of the metal pressing member of the elastic pressure-bonding member of the thermocompression bonding head is formed in a taper shape toward an outward of an opening of the metal pressing member.