Patent Assignment
Reel/Frame 022059/0157
Assignment of Assignor's Interest
Recorded: 2009-01-05
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Memory Device with Multi-Plane Architecture