IP Library › Assignment 022068/0926
Patent Assignment
Reel/Frame 022068/0926

Assignment of Assignor's Interest

Recorded: 2009-01-07 Pages: 4
Assignors
WEICHART, JURGEN
Executed: 2008-11-24
KADLEC, STANISLAV
Executed: 2008-12-09
Assignee
OC OERLIKON BALZERS AG
IRAMALI 18, P.O. BOX 1000, BALZERS, 9496, LIECHTENSTEIN
Covered Property (1)
Application of Hipims to Through Silicon via Metallization in Three-Dimensional Wafer Packaging
Patent: 8,475,634 →
Application: 12/257,570 →
Publication: US 2009/0111216
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 17, 2014
From: OC OERLIKON BALZERS AG
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 031990/0679 →
Assignment of Assignor's Interest Jan 20, 2014
From: OC OERLIKON BALZERS AG
To: OERLIKON ADVANCED TECHNOLOGIES AG
Reel/Frame 032001/0531 →
Assignment of Assignor's Interest Mar 12, 2019
From: EVATEC ADVANCED TECHNOLOGIES AG (FORMALLY KNOWN AS OERLIKON ADVANCED TECHNOLOGIES AG)
To: EVATEC AG
Reel/Frame 048566/0808 →