IP Library › Assignment 031990/0679

Patent Assignment

Reel/Frame 031990/0679

Assignment of Assignor's Interest

Recorded: 2014-01-17 Pages: 4

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Assignor

OC OERLIKON BALZERS AG

Executed: 2013-09-01

Assignee

OERLIKON ADVANCED TECHNOLOGIES AG

IRAMALI 18, BALZERS, LIECHTENSTEIN

Covered Properties (37)

Process and Apparatus for Sputter Etching or Sputter Coating

Patent: 6,248,219 →

Application: 08/418,256 →

Process and Apparatus for the Production of a Metal Oxide Layer

Patent: 5,618,575 →

Application: 08/427,658 →

Device for the Vacuum-Tight Connecting of Two Bodies of Different Materials

Patent: 6,412,821 →

Application: 09/170,091 →

Magnetron Sputtering Source and Method of Use Thereof

Patent: 6,540,883 →

Application: 09/243,814 →

Vacuum Treatment Equipment

Patent: 6,325,856 →

Application: 09/338,569 →

Method for Producing Epitaxial Silicon Germanium Layers

Patent: 6,313,016 →

Application: 09/469,752 →

Sputter Chamber as Well as Vacuum Transport Chamber and Vacuum Handling Apparatus with Such Chambers

Patent: 6,899,795 →

Application: 09/484,421 →

Holding Device

Patent: 6,511,543 →

Application: 09/581,857 →

Vacuum Treatment System

Patent: 6,527,927 →

Application: 09/587,452 →

Method for the Production of Substrates, Magnetron Source and Sputter-Coating Chamber

Patent: 6,579,424 →

Application: 09/775,527 →

Publication: US 2001/0022271

Vacuum Treatment Chamber and Method for Treating Surfaces

Patent: 6,814,838 →

Application: 09/821,787 →

Publication: US 2002/0000368

Coating Installation for Disk-Form Workpieces

Patent: 6,656,330 →

Application: 09/886,678 →

Publication: US 2002/0005165

Vacuum Treatment Equipment

Patent: 6,481,955 →

Application: 09/987,605 →

Publication: US 2002/0029854

Method for Producing Coated Substrates

Patent: 6,835,414 →

Application: 10/002,996 →

Publication: US 2003/0021895

Magnetron Sputter Source with Multipart Target

Patent: 6,692,618 →

Application: 10/134,915 →

Publication: US 2002/0162737

Magnetron Sputter Source

Patent: 6,682,637 →

Application: 10/161,862 →

Publication: US 2003/0136671

Method for Controlling Plasma Density or the Distribution Thereof

Patent: 6,821,397 →

Application: 10/225,717 →

Publication: US 2003/0042130

Procedure and Device for the Production of a Plasma

Patent: 7,476,301 →

Application: 10/256,718 →

Publication: US 2003/0075522

Vacuum Treatment System and Method of Manufacturing Same

Patent: 7,105,080 →

Application: 10/334,564 →

Publication: US 2003/0098231

Arrangement for Orienting the Magnetization Direction of Magnetic Layers

Patent: 6,790,482 →

Application: 10/336,514 →

Publication: US 2003/0129104

Method of Producing a Substrate with a Surface Treated by a Vacuum Treatment Process, Use of Said Method for the Production of Coated Workpieces and Plasma Treatment Chamber

Patent: 7,138,343 →

Application: 10/536,204 →

Publication: US 2006/0054493

Installation for Processing a Substrate

Patent: 7,736,462 →

Application: 10/542,075 →

Publication: US 2006/0108231

Method and Apparatus for Ald on a Rotary Susceptor

Patent: 6,869,641 →

Application: 10/612,513 →

Publication: US 2004/0052972

Method for Manufacturing a Workpiece Using a Magnetron Sputter Source

Patent: 6,860,977 →

Application: 10/703,217 →

Publication: US 2004/0149565

Method for Manufacturing Sputter-Coated Substrates, Magnetron Source and Sputtering Chamber with Such Source

Patent: 7,718,042 →

Application: 10/798,331 →

Publication: US 2005/0199485

Atomic Layer Deposition

Patent: 7,153,363 →

Application: 10/850,741 →

Publication: US 2004/0214437

Sputter Chamber as Well as Vacuum Transport Chamber and Vacuum Handling Apparatus with Such Chambers

Patent: 7,033,471 →

Application: 10/919,273 →

Publication: US 2005/0016843

Method for Controlling Plasma Density or the Distribution Thereof

Patent: 7,368,041 →

Application: 10/967,383 →

Publication: US 2005/0051423

Method for the Production of a Substrate

Patent: 7,429,543 →

Application: 11/539,218 →

Publication: US 2007/0084715

Target arrangement for mounting / dismounting and method of manufacturing

Patent: 8,540,850 →

Application: 11/639,034 →

Publication: US 2007/0144899

Method for Positioning a Wafer

Patent: 7,706,908 →

Application: 11/815,741 →

Publication: US 2008/0152474

Rf Substrate Bias with High Power Impulse Magnetron Sputtering (Hipims)

Patent: 8,435,389 →

Application: 11/954,490 →

Publication: US 2008/0135401

Method for Controlling Plasma Density or the Distribution Thereof

Patent: 7,678,240 →

Application: 12/053,299 →

Publication: US 2008/0210548

Application of Hipims to Through Silicon via Metallization in Three-Dimensional Wafer Packaging

Patent: 8,475,634 →

Application: 12/257,570 →

Publication: US 2009/0111216

Method of Magnetron Sputtering and a Method for Determining a Power Modulation Compensation Function for a Power Supply Applied to a Magnetron Sputtering Source

Patent: 8,246,794 →

Application: 12/327,960 →

Publication: US 2009/0173621

Rf Sputtering Arrangement

Patent: 8,268,142 →

Application: 12/644,596 →

Publication: US 2010/0155238

Process for the Deposition of an Anti-Reflection Film on a Substrate

Patent: 8,263,489 →

Application: 13/011,109 →

Publication: US 2011/0177649

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