Target arrangement for mounting / dismounting and method of manufacturing
View Patent ↗So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border ( 7 ) defined by a first wedge surface ( 5 u ) angled to the addressed general plane (E) and a second wedge surface ( 5 l ) which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.
1. A material source comprising a removable target arrangement,
the target arrangement comprising a plate, separable first and second clamping means, and at least one clamp biasing member for biasing the first and second clamping means towards each other to clamp part of the plate therebetween,
wherein said target arrangement can be mounted and dismounted as a unitary part onto and off of said material source, the target arrangement of the material source being provided to free material to a vacuum coating process,
wherein the plate of said target arrangement is provided along a plane, at least a predominant part of an outer border of said plate being wedge-shaped by a first substantially planar wedge surface angled to said plane and a second substantially planar wedge surface angled to said plane, said first and second wedge surfaces mutually converging in a direction along said plane and from a central area of said plate perpendicularly towards said outer border of said plate, the first and second clamping means are respectively provided with a first and a second substantially planar wedge counter surface, and said first and second clamping means being biased towards each other with said first and second wedge counter surfaces biased towards and on said first and second wedge surfaces, the clamp biasing member exerting a force which is generally perpendicular to the plane and which creates a pressure between said wedge surfaces and counter surfaces to thereby clamp the plate, and
wherein the target arrangement, including the first and second clamping means, the plate clamped by the clamping means, and the at least one clamp biasing member, is releasably mounted to a frame of said material source by at least one frame mounting element,
wherein the frame mounting element and the clamp biasing member are distinct and independently releasable elements, and
wherein the frame mounting element is releasably connected to the frame of the material source and the clamp biasing member is not directly connected to the frame of the material source.
2. The arrangement of claim 1 wherein said plate has a surface parallel to said plane which is of said material.
3. The arrangement of claim 1 , wherein said plate is a target.
4. The arrangement of claim 1 , wherein said part of said outer border of said plate is of ferromagnetic material.
5. The arrangement of claim 4 , wherein said material to be freed is ferromagnetic material.
6. The arrangement of claim 1 , being a sputter target arrangement.
7. The arrangement of claim 1 , wherein said first and second wedge surfaces are substantially equally angled to said plane.
8. A method of manufacturing a device including the step of applying at least one layer comprising a ferromagnetic material on a substrate, comprising the steps of:
mounting a target arrangement to a magnetron source, within a vacuum chamber, said target arrangement comprises a plate along a plane, with separable first and second clamping means, and at least one clamp biasing member for biasing said clamping means towards each other, wherein at least a predominant part of an outer border of said plate is wedge-shaped having a first substantially planar wedge surface angled to said plane and a second substantially planar wedge surface angled to said plane, said first and second wedge surfaces mutually converging in a direction along said plane and from a central area of said plate perpendicularly towards said outer border of said plate,
clamping said first and second wedge surfaces of the plate border by biasing said first and second clamping means provided with a first and a second substantially planar wedge counter surface, and said first and second clamping means being biased towards each other by the at least one clamp biasing member with the first and second wedge counter surfaces biased towards and on said first and second wedge surfaces, positioning at least one substrate with a surface to be coated facing towards said mounted target arrangement, said target arrangement, including said plate, said clamp biasing member, and said clamping means, being releasably mounted to a frame of the magnetron source by at least one frame mounting element which is distinct and separately operable from the at least one clamp biasing member, and
sputter coating said substrate.
9. The method of claim 8 , said device being one of a read head, a write head, a read/write head, all for storage disks, a magnetic data storage disc, or a semiconductor device.
10. A magnetron sputter source comprising a target arrangement according to claim 4 , and a magnet arrangement generating a magnetic field upon said target arrangement.
11. The arrangement of claim 1 wherein the first and second clamping means are adjustably biased towards said first and second wedge surfaces of said outer border of said plate.
12. The method of claim 8 wherein the first and second clamping means are adjustably biased towards said first and second wedge surfaces of said outer border of said plate.