Patent Assignment
Reel/Frame 022079/0621
Assignment of Assignor's Interest
Recorded: 2009-01-08
Pages: 3
Assignor
SAIMEN, MUNEHIDE
Executed: 2008-11-25
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Flexible Substrate and Flexible Substrate Punching Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.