Method for manufacturing flexible substrate and flexible substrate punching device
View Patent ↗A method for manufacturing a flexible substrate includes punching out a flexible substrate from a flexible tape wherein the flexible substrate has a first contour that is a part of a contour of the flexible substrate, and a second contour that is a remaining portion of the contour other than the first contour, and requires a punching accuracy lower than a punching accuracy of the first contour. The method includes the steps of: operating a first die by a control section to punch out the first contour from the flexible tape; judging by the control section as to whether a punching accuracy of the first contour meets a standard; and operating a second die by the control section to punch out the second contour from the flexible tape thereby separating the flexible substrate from the flexible tape when the control section judges that the punching accuracy of the first contour meets the standard, and not operate the second die when the control section judges that the punching accuracy of the first contour does not meet the standard.
1. A method for manufacturing a flexible substrate including punching out a flexible substrate from a flexible tape, wherein the flexible substrate has a first contour that is a part of a contour of the flexible substrate, and a second contour that is a remaining portion of the contour other than the first contour, and requires a punching accuracy lower than a punching accuracy of the first contour, the method comprising the steps of:
operating a first die by a control section to punch out the first contour from the flexible tape;
judging by the control section as to whether a punching accuracy of the first contour meets a standard; and
operating a second die by the control section to punch out the second contour from the flexible tape thereby separating the flexible substrate from the flexible tape when the control section judges that the punching accuracy of the first contour meets the standard, and not operating the second die when the control section judges that the punching accuracy of the first contour does not meet the standard;
wherein the flexible tape is provided with a reference pattern of a simpler configuration than a configuration of the first contour in an area other than an area of the flexible substrate to be punched out;
the control section controls in the step of punching out the first contour the first die to punch out the first contour and the reference pattern;
in the step of judging as to whether the punching accuracy of the first contour meets the standard, the control section judges as to whether the punching accuracy meets the standard by measuring the punching accuracy of the reference pattern by image processing.
2. The method of claim 1 , wherein the judging step is subsequent to the step of operating the first die.
3. The method of claim 1 , wherein the flexible tape is further provided with a reference mark that exists prior to operating the first die, wherein measuring the punching accuracy of the reference pattern comprises measuring a distance between at least a certain portion of the reference pattern and at least a certain portion of the reference mark.
4. The method of claim 3 , wherein the reference pattern and the reference mark are both substantially circular, and measuring the punching accuracy of the reference pattern comprises measuring the distance between a center of the reference pattern and a center of the reference mark.