Patent Assignment
Reel/Frame 022082/0507
Assignment of Assignor's Interest
Recorded: 2009-01-09
Pages: 2
Assignor
KATOU, HIROAKI
Executed: 2008-12-11
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KANAGAWA, KAWASAKI-SHI, 211-8668, JAPAN
Covered Property
(1)
Manufacturing Method of Bonded Soi Substrate and Manufacturing Method of Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.