Patent Assignment
Reel/Frame 025214/0187
Change of Name
Recorded: 2010-10-28
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(91)
Semiconductor Device with Less Power Supply Noise
Semiconductor Device and Method of Manufacturing Semiconductor Device Including Optical Test Pattern Above a Light Shielding Film
Semiconductor Device Having Capacitor Element
Method of Forming a Semiconductor Device Featuring Copper Wiring Layers of Different Widths Having Metal Capping Layers of Different Thicknesses Formed Thereon
Power Supply Control Circuit
Power Supply Control Circuit
Vertical-Type Field-Effect Transistor Having Embedded Gate Electrode
Application:
12/329,069 →
Publication:
US 2009/0166731
Power Supply Dependent Optical Receiver and Amplifier and Photocoupler Using the Same
Method and Apparatus of Circuit Simulation of High-Withstand-Voltage Mos Transistor
Application:
12/336,012 →
Publication:
US 2009/0164196
Method of Manufacturing a Wiring Substrate and Semiconductor Device
Semiconductor Device
Decoding Apparatus and Decoding Method Using an Additional Add-Compare-Select Operation on Decoded Data in the Event of an Error in the Decoded Data
D/A Conversion Circuit
Data Processing Apparatus and Method, and Program
Data Transfer System and Data Transfer Method
Application:
12/343,977 →
Publication:
US 2009/0172221
Semiconductor Device and Process for Manufacturing Same
Semiconductor Chip and Semiconductor Device Including the Same
Method of Manufacturing Semiconductor Device and Semiconductor Device
Semiconductor Device with High Reliability and Manufacturing Method Thereof
Semiconductor Integrated Circuit Device and Method of Testing Same
Information Storage Device, Information Processing System, and Setting Method of Data Transfer Mode of Information Processing Device
Method for Manufacturing Semiconductor Device
Semiconductor Device
High Efficiency Power Amplifier
Semiconductor Integrated Circuit and Method of Measuring a Maximum Delay
Semiconductor Device and Method for Manufacturing the Same
Wideband Divider
Ccd Device and Method of Driving Same
Power Mosfet
Application:
12/361,067 →
Publication:
US 2009/0200607
Method of Manufacturing a Semiconductor Device Having an Interconnect Structure That Increases in Impurity Concentration as Width Increases
Semiconductor Device Having Shaped Conductive Element
Application:
12/368,659 →
Publication:
US 2009/0146251
Method for Manufacturing Semiconductor Device
Semiconductor Device
Receiving Apparatus
Atomic Layer Deposition Apparatus
Application:
12/370,648 →
Publication:
US 2009/0217873
Photoreceiving Circuit
Manufacturing Method of Bonded Soi Substrate and Manufacturing Method of Semiconductor Device
Method of Forming a Porous Insulation Film
Semiconductor Device and Method for Manufacturing the Same
Application:
12/375,708 →
Publication:
US 2010/0155844
Method for Designing Integrated Circuit Incorporating Memory Macro
Pattern Matching Processing System and Computer Readable Medium
Semiconductor Device Manufacturing Method, Semiconductor Device Manufacturing Equipment, and Computer Readable Medium
Design support system,computer readable medium, semiconductor device designing method and semiconductor device manufacturing method
Application:
12/379,169 →
Publication:
US 2009/0215254
Power Supply Circuit
Semiconductor Device
Semiconductor device and method for testing the same
Application:
12/379,286 →
Publication:
US 2009/0212811
Wiring board and manufacturing method therefor
Application:
12/379,287 →
Publication:
US 2009/0211794
Design method estimating signal delay time with netlist in light of terminal line in macro, and program
Application:
12/379,350 →
Publication:
US 2009/0222784
Circuit Board Test System and Test Method
Semiconductor Device and Semiconductor Device Manufacturing Method
Integrated circuit design method for improved testability
Application:
12/379,411 →
Publication:
US 2009/0212818
Impedance Adjustment Circuit
Frequency Divider Circuit
Nonvolatile Semiconductor Storage Device with Charge Storage Layer and Its Manufacturing Method
Nonvolatile semiconductor storage device with charge storage layer and its manufacturing method
Application:
12/379,509 →
Publication:
US 2009/0224306
Semiconductor Device Including a Plurality of Diffusion Layers and Diffusion Resistance Layer
Semiconductor device and method of manufacturing the same
Application:
12/379,512 →
Publication:
US 2009/0242984
Differential Amplifier
Method, design program and design system for semiconductor device
Application:
12/379,589 →
Publication:
US 2009/0228845
Differential Amplifier
Semiconductor Device
Designing Method of Photo-Mask and Method of Manufacturing Semiconductor Device Using the Photo-Mask
Power Switching Circuit
Plural Voltage Level Detection Upon Power Drop for Switching to Standby Mode with or Without Complete State Saving Interrupt Processing
Semiconductor Device Including Capacitor Element and Method of Manufacturing the Same
Wiring model library constructing device and constructing method, and layout parameter extracting device and extracting method
Application:
12/379,765 →
Publication:
US 2009/0228854
Semiconductor Device Including Address Signal Generating Portion and Digital-to-Analog Converter
Dc-Dc Converter Control Circuit
Semiconductor Device and Method of Fabricating the Same
Host device and scheduling method
Application:
12/379,987 →
Publication:
US 2009/0287862
Semiconductor device having plural power source terminals coupled to function block and method of controlling the same
Application:
12/379,989 →
Publication:
US 2009/0224604
Drive Signal Generating Apparatus and Drawing Apparatus
Flux for soldering and method for manufacturing an electronic device using the same
Application:
12/382,054 →
Publication:
US 2009/0230175
Differential Amplifier and Drive Circuit of Display Device Using the Same
Semiconductor Integrated Circuit
Integrated Circuit Including Built-in Self Test Circuit to Test Memory and Memory Test Method
Semiconductor Integrated Circuit Device Having Overcurrent Limitation Circuit
Semiconductor Memory Device
Process for manufacturing semiconductor device and semiconductor device manufactured by such process
Application:
12/382,538 →
Publication:
US 2009/0250826
Semiconductor Wafer, Semiconductor Device, and Method of Manufacturing Semiconductor Device
Input Circuit and Semiconductor Integrated Circuit Including the Same
Multilayer Wiring Substrate, Semiconductor Package, and Method of Manufacturing Semiconductor Package
Automatic transistor arrangement device to arrange serially connected transistors, and method thereof
Application:
12/382,547 →
Publication:
US 2009/0254870
Semiconductor Device Having Wiring Formed on Wiring Board and Electric Conductor Formed in Wiring Board and Conductor Chip Formed Over Wiring
Display driving circuit including output circuit having test circuit and test method thereof
Application:
12/382,601 →
Publication:
US 2009/0237394
Semiconductor package having thermal stress canceller member
Application:
12/382,613 →
Publication:
US 2009/0250809
Analog multiplexer and its select signal generating method
Application:
12/382,672 →
Publication:
US 2009/0267679
Semiconductor Device
Analysis apparatus and analysis method for semiconductor device
Application:
12/382,677 →
Publication:
US 2009/0236523
Semiconductor Device
Capacitive Sensing Device and Method
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 26, 2008
From: NAMBU, HIDETAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021895/0095 →
Assignment of Assignor's Interest
Nov 26, 2008
From: KATOU, TETSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021893/0073 →
Assignment of Assignor's Interest
Dec 1, 2008
From: INOUE, KEN; INOUE, TOMOKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021902/0483 →
Assignment of Assignor's Interest
Dec 1, 2008
From: TAKEWAKI, TOSHIYUKI; UENO, KAZUYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021905/0974 →
Assignment of Assignor's Interest
Dec 4, 2008
From: NAKAHARA, AKIHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021945/0614 →
Assignment of Assignor's Interest
Dec 5, 2008
From: MARUOKA, MICHIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021931/0448 →
Assignment of Assignor's Interest
Dec 5, 2008
From: NAKAHARA, AKIHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021931/0385 →
Assignment of Assignor's Interest
Dec 11, 2008
From: SHIMIZU, MASAFUMI; SAWAMOTO, SHINYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021966/0074 →
Assignment of Assignor's Interest
Dec 16, 2008
From: SAITOU, FUMITOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021988/0166 →
Assignment of Assignor's Interest
Dec 22, 2008
From: TSUKANO, JUN; OGAWA, KENTA; MAEDA, TAKEHIKO
To: NEC ELECTRONICS CORPORATION; NEC CORPORATION
Reel/Frame 022018/0912 →
Assignment of Assignor's Interest
Dec 23, 2008
From: TAKANASHI, MITSUNORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022022/0205 →
Assignment of Assignor's Interest
Dec 24, 2008
From: TONAMI, MASAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022029/0546 →
Assignment of Assignor's Interest
Dec 24, 2008
From: KAWANO, TAKAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022027/0125 →
Assignment of Assignor's Interest
Dec 24, 2008
From: IIMA, TOMOFUMI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022027/0384 →
Assignment of Assignor's Interest
Dec 29, 2008
From: MATSUBARA, YOSHIHISA; SAKOH, TAKASHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022033/0558 →
Assignment of Assignor's Interest
Jan 5, 2009
From: NAKATSU, SHINICHI; IGOGAI, HIDEO; MASUMOTO, TAKEHIRO; NISHIZAWA, KAZUYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022054/0096 →
Assignment of Assignor's Interest
Jan 5, 2009
From: KOBAYASHI, KENYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022055/0634 →
Assignment of Assignor's Interest
Apr 1, 2009
From: KUMAGAI, HOKUTO, MR.
To: NEC ELECTRIONICS CORPORATION
Reel/Frame 022483/0204 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →