Semiconductor device with high reliability and manufacturing method thereof
View Patent ↗A semiconductor device is provided, which includes a substrate, an insulator film formed over the substrate, and plural metal wirings with different widths containing copper as a main component and an impurity which is different from copper. The plural metal wirings includes a first metal wiring having a concentration profile where the concentration of the impurity metal increases from the center part of the stacking direction to the surface and the second metal wiring having a concentration profile where the concentration of the impurity metal decreases from the bottom surface of the stacking direction to the surface. Moreover, the width of the second metal wiring may be larger than the width of the first metal wiring.
1. A semiconductor device comprising:
a substrate;
an insulator film formed over the substrate;
a plurality of metal wirings with different widths in a first direction which are formed in the insulator film, contains copper as a main component, and contains an impurity metal which is different from copper,
the metal wiring having a thickness in a second direction perpendicular to the first direction,
wherein the plurality of metal wirings includes:
a first metal wiring with a concentration profile in the second direction in which the concentration of the impurity metal increases, in the second direction, from a center part of the first metal wiring to an upper surface of the first metal wiring; and
a second metal wiring with a concentration profile of the second direction in which the concentration of the impurity metal decreases, in the second direction, from a bottom surface of the second metal wiring to an upper surface of the second metal wiring, and
wherein the width of the second metal wiring is larger than the width of the first metal wiring, and the first metal wiring has a minimum wiring pitch in the semiconductor device.
2. The semiconductor device according to claim 1 , wherein the impurity metal includes one selected from the group of Be, Mg, Zn, Pd, Ag, Cd, Au, Hg, Pt, Si, Zr, Al, and Ti.
3. The semiconductor device according to claim 1 , wherein the first metal wiring and the second metal wiring are formed in the same layer.
4. The semiconductor device according to claim 1 , wherein the second metal wiring has a maximum width in the semiconductor device.
5. The semiconductor device according to claim 1 , wherein the first metal wiring has a minimum wiring pitch in the semiconductor device, and wherein the second metal wiring has a maximum width in the semiconductor device.
6. A semiconductor device, comprising:
a substrate;
a first metal wiring which is formed over the substrate, contains copper as a main component, and contains an impurity metal which is different from copper;
a second metal wiring which is formed over the substrate, contains copper as a main component, contains an impurity metal which is different from copper, and is wider than the first metal wiring in a first direction,
the first metal wiring and the second metal wiring having a thickness in a second direction perpendicular to the first direction,
wherein the first metal wiring has a concentration profile of the second direction in which the concentration of the impurity metal increases, in the second direction from a center part of the first metal wiring to an upper surface of the first metal wiring, the concentration of the impurity metal of the surface of the first metal wiring is higher than the concentration of the impurity metal of an upper surface of the second metal wiring, and the first metal wiring has a minimum wiring pitch in the semiconductor device.
7. The semiconductor device according to claim 6 , wherein the second metal wiring has a different concentration profile of the impurity metal in the second direction from the concentration profile of the impurity metal in the second direction of the first metal wiring.
8. The semiconductor device according to claim 6 , wherein the second metal wiring has a concentration profile in which the concentration of the impurity metal decreases from a bottom surface in the second direction to the surface.
9. The semiconductor device according to claim 6 , wherein the impurity metal is one selected from the group of Be, Mg, Zn, Pd, Ag, Cd, Au, Hg, Pt, Si, Zr, Al, and Ti.
10. The semiconductor device according to claim 6 , wherein the first metal wiring and the second metal wiring are formed in the same layer.
11. The semiconductor device according to claim 6 , wherein the second metal wiring has a maximum width in the semiconductor device.
12. The semiconductor device according to claim 1 , wherein the concentration of the impurity metal of the surface of the first metal wiring is higher than the concentration of the impurity metal of the surface of the second metal wiring.