Semiconductor integrated circuit device and method of testing same
View Patent ↗A semiconductor integrated circuit device includes a first chip that is directly accessible from outside, a second chip that transmits and receives data to and from the first chip, the second chip being not directly accessible from outside, and a through circuit that is provided in the first chip and transmits first and second test signals input from an external device to the second chip, wherein the through circuit includes a first signal transmission path to generate a first signal by synchronizing the first test signal to a clock signal input from the external device and to output it to the second chip and a second signal transmission path to generate a second signal by synchronizing the second test signal to a test clock signal input from the external device and to output it to the second chip.
1. A semiconductor integrated circuit device comprising:
a first chip that is directly accessible from outside;
a second chip that transmits and receives data to and from the first chip, the second chip being not directly accessible from outside; and
a through circuit that is provided in the first chip and transmits a first test signal and a second test signal to the second chip, the first and second test signals being input from an external device;
wherein the through circuit comprises:
a first signal transmission path to generate a first signal by synchronizing the first test signal to a clock signal input from the external device and to output the first signal to the second chip; and
a second signal transmission path to generate a second signal generated by synchronizing the second test signal to a test clock signal input from the external device and to output the second signal to the second chip.
2. The semiconductor integrated circuit device according to claim 1 , wherein the first signal is a data signal for the second chip, and the second signal is a strobe signal used as a synchronous clock for the data signal.
3. The semiconductor integrated circuit device according to claim 2 , wherein the test clock signal has the same clock cycle as the clock signal and a predefined delay from the clock signal.
4. The semiconductor integrated circuit device according to claim 1 , wherein the first signal is a strobe signal for the second chip, and the second signal is a data signal in synchronization with the strobe signal.
5. The semiconductor integrated circuit device according to claim 4 , wherein the clock signal has the same clock cycle as the test clock signal and a predefined delay from the test clock signal.
6. The semiconductor integrated circuit device according to claim 1 , wherein the first chip is a logic chip having a function circuit thereon, and the second chip is a DDR memory.
7. The semiconductor integrated circuit device according to claim 6 , wherein:
the logic chip comprises an external interface terminal; and
the DDR memory comprises an interface terminal to the logic chip;
wherein the DDR memory comprises:
a data input/output terminal; and
a strobe terminal to input or output a strobe signal for a data signal, the data signal being input or output through the data input/output terminal; and
wherein the logic chip comprise a control circuit to control input/output timing of the strobe terminal.
8. The semiconductor integrated circuit device according to claim 7 , wherein the control circuit:
outputs the data signal to the data input/output terminal in synchronization with a first clock input from an external device; and
controls the input/output timing of the strobe terminal in synchronization with a second clock signal input from the external device.
9. The semiconductor integrated circuit device according to claim 8 , wherein the second clock signal has a predefined delay from the first clock signal.
10. The semiconductor integrated circuit device according to claim 8 , wherein the first clock signal has a predefined delay from the second clock signal.
11. A method of testing a semiconductor integrated circuit device comprising a first chip and a second chip in a single package, the first chip being directly accessible from outside and the second chip being accessed from outside through the first chip, the method comprising:
synchronizing a first test signal supplied from an external device to a clock signal supplied from the external device;
supplying the synchronized first test signal to the second chip as a first signal;
synchronizing a second test signal supplied from the external device to a test clock signal supplied from the external device; and
supplying the synchronized second test signal to the second chip as a second signal.
12. The method of testing a semiconductor integrated circuit device according to claim 11 , wherein the first signal is a data signal for the second chip, and the second signal is a strobe signal used as a synchronous clock for the data signal.
13. The method of testing a semiconductor integrated circuit device according to claim 12 , wherein the test clock signal has the same clock cycle as the clock signal and a predefined delay from the clock signal.
14. The method of testing a semiconductor integrated circuit device according to claim 11 , wherein the first signal is a strobe signal for the second chip, and the second signal is a data signal in synchronization with the strobe signal.
15. The method of testing a semiconductor integrated circuit device according to claim 14 , wherein the clock signal has the same clock cycle as the test clock signal and a predefined delay from the test clock signal.
16. The method of testing a semiconductor integrated circuit device according to claim 11 , wherein the first chip is a logic chip having a function circuit thereon, and the second chip is a DDR memory.