Semiconductor device
View Patent ↗In recent years, as electronic equipment becomes thinner, an area for mounting a semiconductor device used in the electronic equipment is required to be smaller, and a thickness of an encapsulating resin for encapsulating a semiconductor substrate having a circuit formed thereon and the like also becomes smaller. The encapsulating resin is marked with a product number, a manufacturer name, or the like. There arises a problem in that, in the marking, an infrared laser beam applied to the encapsulating resin passes through the encapsulating resin, generates heat in the semiconductor substrate, and destructs the formed circuit. By providing a thin film for refracting the infrared laser beam on a rear surface of the semiconductor substrate, the optical path of the infrared laser beam is made longer to reduce heat generated in the semiconductor substrate.
1. A semiconductor device, comprising:
a package substrate;
a connecting portion provided on the package substrate;
a semiconductor substrate having a main surface and a surface opposite to the main surface, the main surface having connecting terminals formed so as to correspond to the connecting portion and connected to the connecting portion, and the surface opposite to the main surface having a thin film formed thereon; and
an encapsulating resin for encapsulating the connecting portion, the semiconductor substrate, and the thin film,
wherein the thin film has an index of refraction which is smaller than an index of refraction of the encapsulating resin, and wherein the thin film comprises a first thin film and a second thin film, the second thin film being located below the first thin film and having an index of refraction different from an index of refraction of the first thin film.
2. A semiconductor device according to claim 1 , wherein the index of refraction of the second thin film is smaller than the index of refraction of the first thin film.
3. A semiconductor device according to claim 1 , wherein:
the connecting portion is a first connecting portion; and
the semiconductor device further comprises a second connecting portion which is provided on a surface of the package substrate opposite to a surface of the package substrate having the first connecting portion provided thereon and is used for electrical connection between the package substrate and another device.
4. A semiconductor device according to claim 3 , wherein the first connecting portion is a plurality of solder balls provided so as to be spaced apart from one another.
5. A semiconductor device according to claim 4 , further comprising a resin which is provided between the package substrate and the semiconductor substrate and covers the plurality of solder balls.
6. A semiconductor device according to claim 3 , wherein the second connecting portion is a plurality of solder balls provided so as to be spaced apart from one another.
7. A semiconductor device according to claim 3 , further comprising a mounting substrate connected to the second connecting portion.
8. A semiconductor device according to claim 1 , wherein:
the encapsulating resin comprises an epoxy resin; and
the thin film comprises SiO 2 .
9. A semiconductor device, comprising:
a package substrate;
a connecting portion provided on the package substrate;
a semiconductor substrate having a main surface and a surface opposite to the main surface, the main surface having connecting terminals formed so as to correspond to the connecting portion and connected to the connecting portion, and the surface opposite to the main surface having a thin film formed thereon; and
an encapsulating resin for encapsulating the connecting portion, the semiconductor substrate, and the thin film,
wherein the thin film makes an optical path of light longer, the light passing through the encapsulating resin, and wherein the thin film comprises a first thin film and a second thin film, the second thin film being located below the first thin film and having an index of refraction different from an index of refraction of the first thin film.