Patent Assignment
Reel/Frame 021905/0974
Assignment of Assignor's Interest
Recorded: 2008-12-01
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Forming a Semiconductor Device Featuring Copper Wiring Layers of Different Widths Having Metal Capping Layers of Different Thicknesses Formed Thereon
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.