Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon
View Patent ↗In a semiconductor device, an insulating interlayer is provided above a semiconductor substrate, and a plurality of first wiring layers and a plurality of second wiring layers are formed in the insulating interlayer. The first wiring layers are substantially composed of copper, and are arranged in parallel at a large pitch. The second wiring layers are substantially composed of copper, and are arranged in parallel at a small pitch. A first metal capping layer is formed on each of the first wiring layers, and a second metal capping layer is formed on each of the second wiring layers. The second metal capping layer has a smaller thickness than that of the first metal capping layer.
1. A method for manufacturing a semiconductor device, comprising:
a first step of forming a first wiring layer and a second wiring layer which are substantially composed of copper, a width of said first wiring layer is wider than that of said second wiring layer; and
a second step of forming a first metal capping layer and a second capping layer on said respective first and second wiring layers, the formation of said second metal capping layer is carried out at a smaller time than a time at which the formation of said first metal capping layer is carried out,
wherein said second step is executed such that the formation of said second metal capping layer is started later after a starting of the formation of said first metal capping layer, and such that both the formations of said first and second metal capping layers end at substantially a same time,
wherein said first step includes a step of forming a first copper oxide layer and a second copper oxide layer on said respective first and second wiring layers, and
wherein said second step includes:
a step of immersing the semiconductor device in a plating solution containing a copper oxide removal agent for removing said first and second copper oxide layers from said first and second wiring layers;
a step of removing said first and second copper oxide layers with said copper oxide removal agent; and
a step of carrying out both the formations of said first and second metal capping layers by said plating solution after the removals of said first and second copper oxide layers.
2. The method as set forth in claim 1 , wherein a thickness of said first copper oxide layer is thinner than that of said second copper oxide layer.
3. The method as set forth in claim 1 , wherein said first step includes:
a step of forming an insulating interlayer;
a step of forming a first trench and a second trench in said insulating interlayer, said second trench being narrower than said first trench;
a step of forming a first barrier layer containing tantalum nitride as a main component and a second barrier layer containing tantalum as a main component in said respective first and second trenches;
a step of carrying out both the formations of said first and second wiring layers on said respective first and second barrier layers.