Patent Assignment
Reel/Frame 022018/0912
Assignment of Assignor's Interest
Recorded: 2008-12-22
Pages: 3
Assignors
TSUKANO, JUN
Executed: 2007-06-25
OGAWA, KENTA
Executed: 2007-06-25
MAEDA, TAKEHIKO
Executed: 2007-06-25
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Method of Manufacturing a Wiring Substrate and Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.