Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package
View Patent ↗A multilayer wiring substrate included in the semiconductor package includes: a first insulating layer and a second insulating layer, in which wiring layers are respectively provided on the upper and the lower surfaces; and; a core layer provided between the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are constituted by different materials from each other.
1. A semiconductor package comprising:
a multilayer wiring substrate;
a semiconductor chip installed on said multilayer wiring substrate; and
a sealing resin which seals said semiconductor chip, wherein said multilayer wiring substrate includes:
a first insulating layer including wiring layers provided on the upper and the lower surfaces thereof;
a second insulating layer including wiring layers provided on the upper and the lower surfaces thereof; and
a core layer provided between said first insulating layer and said second insulating layer,
wherein said first insulating layer is constituted by a material different from that of said second insulating layer.
2. The semiconductor package as set forth in claim 1 , wherein said first insulating layer has an equal film thickness to that of said second insulating layer.
3. The semiconductor package as set forth in claim 1 , wherein a difference between existence ratios of wiring of said wiring layer provided on the upper and lower surfaces of said first insulating layer to the plane area of said first insulating layer, and existence ratios of wiring of said wiring layer provided on the upper and lower surfaces of said second insulating layer to the plane area of said second insulating layer is equal to or smaller than 20%.
4. The semiconductor package as set forth in claim 1 , wherein the linear expansion coefficient of said first insulating layer, and that of said second insulating layer are different by 1 ppm/° C. or more.
5. The semiconductor package as set forth in claim 1 , wherein said multilayer wiring substrate has a warp at 250°C.
6. A multilayer wiring substrate, including:
a first insulating layer including wiring layers provided on the upper and the lower surfaces thereof;
a second insulating layer including wiring layers provided on the upper and the lower surfaces thereof; and
a core layer provided between said first insulating layer and said second insulating layer,
wherein said first insulating layer is constituted by a material different from that of said second insulating layer.
7. The multilayer wiring substrate as set forth in claim 6 , wherein said first insulating layer has an equal film thickness to that of said second insulating layer.
8. The multilayer wiring substrate as set forth in claim 6 , wherein a difference between existence ratios of wiring of said wiring layer provided on the upper and lower surfaces of said first insulating layer to the plane area of said first insulating layer, and existence ratios of wiring of said wiring layer provided on the upper and lower surfaces of said second insulating layer to the plane area of said second insulating layer is equal to or smaller than 20%.
9. The multilayer wiring substrate as set forth in claim 6 , wherein the linear expansion coefficient of said first insulating layer and that of said second insulating layer are different by 1 ppm/° C. or more.
10. The multilayer wiring substrate as set forth in claim 6 , having a warp at 250° C.