IP Library › Assignment 022465/0811
Patent Assignment
Reel/Frame 022465/0811

Assignment of Assignor's Interest

Recorded: 2009-03-18 Pages: 3
Assignor
MIYAGAWA, YUICHI
Executed: 2009-02-26
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Multilayer Wiring Substrate, Semiconductor Package, and Method of Manufacturing Semiconductor Package
Patent: 7,986,035 →
Application: 12/382,546 →
Publication: US 2009/0250802
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0187 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →