IP Library Granted Patent US 7,986,156
Granted Patent B2
US 7,986,156 · App. 12/379,773 · Granted Jul 26, 2011

Semiconductor device including address signal generating protion and digital-to-analog converter

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Quick Facts
Patent No.
US 7,986,156
App. No.
12/379,773
Granted
Jul 26, 2011
Kind
B2
Abstract

An exemplary aspect of an embodiment of the present invention is a semiconductor device including a plurality of test elements formed in an array on a semiconductor substrate, an address signal generating portion that generates an address signal corresponding to each of the test elements, and a digital-to-analog converter that converts the address signal into an analog signal and outputs the converted analog signal. The present invention enables to recognize which DUT is being measured.

Claims (34)

1. A semiconductor device, comprising:

a plurality of test elements formed in an array on a semiconductor substrate;

an address signal generating portion that generates an address signal corresponding to each of the test elements;

a digital-to-analog converter that receives the address signal other than through the plurality of test elements and converts the address signal into an analog signal and outputs the converted analog signal;

wherein the address signal comprises an X-coordinate address signal and a Y-coordinate address signal;

an X-coordinate switch that switches according to the X-coordinate address signal, and a Y-coordinate switch that switches according to the Y-coordinate address signal;

wherein the digital-to-analog converter comprises a resistor string type digital-to-analog converter; and

wherein a conductive type of transistors constituting the digital-to-analog converter is a same conductive type as a conductive type of transistors constituting the X-coordinate switch and the Y-coordinate switch.

2. The semiconductor device according to claim 1 , wherein the address signal comprises a plurality of address signals, and

wherein the semiconductor device further comprises a plurality of digital-to-analog converters, each of which converts a corresponding one of the plurality of address signals into an analog signal and outputs a corresponding converted analog signal.

3. The semiconductor device according to claim 1 , wherein the address signal comprises a plurality of address signals,

wherein the semiconductor device further comprises a selector that selects one of the plurality of address signals, and

wherein the semiconductor device comprises the one digital-to-analog converter that converts the selected one address signal to an analog signal and outputs the converted analog signal.

4. The semiconductor device according to claim 1 , wherein the address signal generating portion comprises a counter and a decoder.

5. The semiconductor device according to claim 4 , wherein any given address signal can be input to the decoder.

6. The semiconductor device according to claim 1 , wherein a deep N-well is formed in an area other than the area where the test element is formed, and no deep N-well is formed in the area where the test element is formed.

7. The semiconductor device according to claim 1 , wherein the digital-to-analog converter receives the address signal directly from the address signal generating portion.

8. The semiconductor device according to claim 1 , wherein the digital-to-analog converter receives the address signal from the address signal generating portion.

9. A semiconductor device, comprising:

a plurality of test elements formed in an array on a semiconductor substrate;

an address signal generating portion that generates an address signal corresponding to each of the test elements;

a digital-to-analog converter that converts the address signal into an analog signal and outputs the converted analog signal as an X-address signal and a Y-address signal;

a plurality of X-coordinate switches formed in the semiconductor substrate to designate an X-axis direction in the plurality of test elements based on the X-address signal; and

a plurality of Y-coordinate switches formed in the semiconductor substrate to designate a Y-axis direction in the plurality of test elements based on the Y-address signal,

wherein a conductive type of transistors constituting the digital-to-analog converter is a same conductive type as a conductive type of transistors constituting the plurality of X-coordinate switches and the plurality of Y-coordinate switches.

10. The semiconductor device according to claim 9 , wherein the address signal generating portion comprises:

a counter to generate a count value; and

a decoder associated with the counter to generate an X-address signal and a Y-address signal based on the count value.

11. The semiconductor device according to claim 9 , wherein the individual test elements of the plurality of test elements are arranged in an X-direction and a Y-direction on the semiconductor substrate.

12. The semiconductor device according to claim 11 , wherein a respective one of the plurality of test elements comprises a transistor.

13. The semiconductor device according to claim 9 , wherein a substrate potential of the plurality of X-coordinate switches and a substrate potential of the plurality of Y-coordinate switches arc isolated from a substrate potential of the plurality of test elements.

14. The semiconductor device according to claim 9 , further comprising a deep N-well formed in a peripheral circuit area of the plurality of test circuit,

wherein the plurality of X-coordinate switches and the plurality of Y-coordinate switches are formed in the peripheral area of the test circuit.

15. The semiconductor device according to claim 9 , further comprising a deep N-well formed below the plurality of X-switches and the plurality of Y-switches.

Assignments (2)
CHANGE OF NAME Recorded Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0187 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2009
From: IKEDA, JUN; HIRATA, MORIHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022387/0830 →