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App. No. 12/382,613 · Confirmation No. 1677

Semiconductor package having thermal stress canceller member

Inventor: Yuichi Yoshida
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2011-03-01 ABN Abandonment 2 View
2010-08-20 CTNF Non-Final Rejection 5 View
2010-08-20 892 List of references cited by examiner 1 View
2010-08-20 SRNT Examiner's search strategy and results 4 View
2010-08-20 SRFW Search information including classification, databases and other search related notes 1 View
2010-08-20 SRNT Examiner's search strategy and results 2 View
2010-08-20 1449 List of References cited by applicant and considered by examiner 1 View
2010-06-01 ELC. Response to Election / Restriction Filed 1 View
2010-06-01 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2010-05-03 CTRS Requirement for Restriction/Election 6 View
2009-10-08 NTC.PUB Notice of Publication 1 View
2009-04-29 PD.FILED.E Priority Documents electronically retrieved by USPTO from a participating IP Office 30 View
2009-04-20 APP.FILE.REC Filing Receipt 3 View
2009-03-19 IDS Information Disclosure Statement (IDS) Form (SB08) 1 View
2009-03-19 FOR Foreign Reference 6 View
2009-03-19 WFEE Fee Worksheet (SB06) 1 View
2009-03-19 WCLM Claims Worksheet (PTO-2022) 1 View
2009-03-19 WFEE Fee Worksheet (SB06) 1 View
2009-03-19 TRNA Transmittal of New Application 8 View
2009-03-19 SPEC Specification 16 View
2009-03-19 CLM Claims 4 View
2009-03-19 ABST Abstract 1 View
2009-03-19 OATH Oath or Declaration filed 2 View
2009-03-19 DRW Drawings-only black and white line drawings 17 View
2009-03-19 136A Authorization for Extension of Time all replies 8 View
2009-03-19 TRAN.LET Transmittal Letter 1 View
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Quick Facts
App. No.
12/382,613
Filed
2009-03-19
Pub. No.
US20090250809A1
Art Unit
2826