IP Library Granted Patent US 8,127,257
Granted Patent B2
US 8,127,257 · App. 12/379,705 · Granted Feb 28, 2012

Designing method of photo-mask and method of manufacturing semiconductor device using the photo-mask

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Quick Facts
Patent No.
US 8,127,257
App. No.
12/379,705
Granted
Feb 28, 2012
Kind
B2
Abstract

In a method of designing a photo-mask, a graphic pattern as a target of development simulation is divided into a plurality of sub graphic patterns which are respectively assigned with a plurality of orthogonal coordinate systems which are not orthogonal to each other. A model-based OPC (optical proximity correction) is performed on each of the plurality of sub graphic patterns by moving sides of the sub graphic pattern in directions parallel to coordinate axes of the orthogonal coordinate system assigned to the sub graphic pattern.

Claims (52)

1. A method of designing a photo-mask, said method comprising:

dividing a graphic pattern as a target of development simulation into a plurality of sub graphic patterns which respectively correspond to a plurality of orthogonal coordinate systems, as executed by a processing unit on a computer, in which the plurality of orthogonal coordinate systems are not orthogonal to each other; and

performing a model-based OPC (optical proximity correction) on each of the plurality of sub graphic patterns by moving sides of each of the sub graphic patterns in a direction parallel to coordinate axes of one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns.

2. The method according to claim 1 , wherein said dividing comprises:

extracting an extension direction of each of sides of the graphic pattern; and

dividing the graphic pattern into the plurality of sub graphic patterns, each of which has the sides parallel to the coordinate axes of the one of the orthogonal coordinate systems.

3. The method according to claim 1 , further comprising:

detecting an acute-angled portion between two of sides of a post-correction graphic pattern obtained by synthesizing a plurality of OPC sub graphic patterns after the model-based OPC is performed; and

correcting the post-correction graphic pattern with a patch pattern for the detected acute-angled portion.

4. The method according to claim 1 , further comprising:

selectively adding a terminal portion to each of end portions of each of a plurality of OPC sub graphic patterns after the model-based OPC is performed on the plurality of sub graphic patterns, such that the terminal portion has parallel sides parallel to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns.

5. The method according to claim 4 , further comprising:

dividing one sub graphic pattern having parallel sides oblique to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns, into a plurality of rectangular patterns such that the OPC is performed on each of the plurality of rectangular patterns.

6. The method according to claim 1 , further comprising:

selectively adding a terminal portion to each of end portions of each of a plurality of OPC sub graphic patterns.

7. The method according to claim 6 , wherein said selectively adding the terminal portion is performed after the model-based OPC is performed on the plurality of sub graphic patterns.

8. The method according to claim 1 , further comprising:

dividing one sub graphic pattern having parallel sides oblique to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns into a plurality of patterns.

9. The method according to claim 1 , wherein that the OPC is performed on each of the plurality of patterns.

10. The method according to claim 1 , wherein each of the plurality of patterns has a rectangular shape.

11. A method of manufacturing a semiconductor device, said method comprising:

designing a photo-mask to produce photo-mask data;

producing a photo-mask based on the photo-mask data; and

manufacturing a semiconductor device by using said photo-mask,

wherein said designing comprises:

dividing a graphic pattern as a target of development simulation into a plurality of

sub graphic patterns which respectively correspond to a plurality of orthogonal coordinate systems, in which the plurality of orthogonal coordinate systems are not orthogonal to each other; and

performing a model-based OPC (optical proximity correction) on each of the plurality of sub graphic patterns by moving sides of each of the sub graphic patterns in a direction parallel to coordinate axes of one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns.

12. The method according to claim 11 , wherein said dividing comprises:

extracting an extension direction of each of sides of the graphic pattern; and

dividing the graphic pattern into the plurality of sub graphic patterns, each of which has the sides parallel to the coordinate axes of the one of the orthogonal coordinate systems.

13. The method according to claim 11 , wherein said designing further comprises:

detecting an acute-angled portion between two of sides of a post-correction graphic pattern obtained by synthesizing a plurality of OPC sub graphic patterns after the model-based OPC is performed; and

correcting the post-correction graphic pattern with a patch pattern for the detected acute-angled portion.

14. The method according to claim 11 , wherein said designing further comprises:

selectively adding a terminal portion to each of end portions of each of a plurality of OPC sub graphic patterns after the model-based OPC is performed on the plurality of sub graphic patterns, such that the terminal portion has parallel sides parallel to the coordinate axes of the

one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns.

15. The method according to claim 14 , wherein said designing further comprises:

dividing one sub graphic pattern having parallel sides oblique to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns, into a plurality of rectangular patterns such that the OPC is performed on each of the plurality of rectangular patterns.

16. A non-transitory computer-readable recording medium in which a computer-readable program is recorded to realize a method of designing a photo-mask, wherein said method comprises:

dividing a graphic pattern as a target of development simulation into a plurality of sub graphic patterns which are respectively assigned with a plurality of orthogonal coordinate systems which are not orthogonal to each other; and

performing a model-based OPC (optical proximity correction) on each of the plurality of sub graphic patterns by moving sides of the sub graphic pattern in directions parallel to coordinate axes of the orthogonal coordinate system assigned to the sub graphic pattern.

17. The recording medium according to claim 16 , wherein said dividing comprises:

extracting an extension direction of each of sides of the graphic pattern; and

dividing the graphic pattern into the plurality of sub graphic patterns, each of which has the sides parallel to the coordinate axes of the one of the orthogonal coordinate systems.

18. The recording medium according to claim 16 , wherein said method further comprises:

detecting an acute-angled portion between two of sides of a post-correction graphic pattern obtained by synthesizing a plurality of OPC sub graphic patterns after the model-based OPC is performed; and

correcting the post-correction graphic pattern with a patch pattern for the detected acute-angled portion.

19. The recording medium according to claim 16 , wherein said method further comprises:

selectively adding a terminal portion to each of end portions of each of a plurality of OPC sub graphic patterns after the model-based OPC is performed on the plurality of sub graphic patterns, such that the terminal portion has parallel sides parallel to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns.

20. The recording medium according to claim 19 , wherein said method further comprises:

dividing one sub graphic pattern having parallel sides oblique to the coordinate axes of the one of the orthogonal coordinate systems that corresponds to said each of the sub graphic patterns, into a plurality of rectangular patterns such that the OPC is performed on each of the plurality of rectangular patterns.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0187 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2009
From: KAWAKAMI, YUKIYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022736/0918 →