Analysis apparatus and analysis method for semiconductor device
An analysis apparatus for a semiconductor device, capable of attaining highly efficient analysis of failure in the semiconductor device by a secondary-electron image, including: a region determination unit which determines a region constituting a secondary-electron image of a semiconductor device to be analyzed obtained by irradiating charged particle beam, based on the secondary-electron image and design data of the semiconductor device as a source of comparison; a material identification unit which identifies a material of each configuration of an image obtained by the region determination unit, based on the design data of the semiconductor device; a unit which calculates a potential in the each region identified by the material identification unit, based on the design data of the semiconductor device; a unit which colors each region of an image obtained by the material identification unit in accordance with the potential and generates a dummy good-product secondary-electron image; and a unit which displays the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed.
1 . An analysis apparatus for a semiconductor device, comprising:
a region determination unit which determines a region constituting a secondary-electron image of a semiconductor device to be analyzed obtained by irradiating charged particle beam, based on the secondary-electron image and design data of the semiconductor device as a source of comparison;
a material identification unit which determines a material of each configuration of an image obtained by the region determination unit, based on the design data of the semiconductor device;
a unit which calculates a potential in the each region identified by the material identification unit, based on the design data of the semiconductor device;
a unit which colors each region of an image obtained by the material identification unit in accordance with the potential and generates a dummy good-product secondary-electron image; and
a unit which displays the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed.
2 . The analysis apparatus for a semiconductor device according to claim 1 , wherein the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed are alternately displayed at the same position of the same screen for comparison thereof.
3 . The analysis apparatus for a semiconductor device according to claim 1 , further comprising a unit which generates a contrast image between the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed.
4 . The analysis apparatus for a semiconductor device according to claim 1 including a secondary-electron image generating apparatus which generates a secondary-electron image by irradiating an object to be observed with charged particle beam and detecting a secondary electron.
5 . An analysis method for a semiconductor device, comprising:
determining a region constituting a secondary-electron image of a semiconductor device to be analyzed obtained by irradiating charged particle beam, based on the secondary-electron image and design data of the semiconductor device as a source of comparison;
determining a material of each configuration of an image obtained by the region determination unit, based on the design data of the semiconductor device;
calculating a potential in the each region identified by the material identification unit, based on the design data of the semiconductor device;
coloring each region of an image obtained by the material identification unit in accordance with the potential and generating a dummy good-product secondary-electron image; and
displaying the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed.
6 . The analysis method for a semiconductor device according to claim 5 , wherein the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed are alternately displayed at the same position of the same screen for comparison thereof.
7 . The analysis method for a semiconductor device according to claim 5 , further comprising generating a contrast image between the dummy good-product secondary-electron image and the secondary-electron image for the semiconductor device to be analyzed.