Patent Assignment
Reel/Frame 022096/0623
Assignment of Assignor's Interest
Recorded: 2009-01-07
Pages: 3
Assignors
TACHIBANA, KENYA
Executed: 2008-11-28
WADA, MASAHIRO
Executed: 2008-11-28
HATAO, TAKUYA
Executed: 2008-11-28
Assignee
SUMITOMO BAKELITE COMPANY LIMITED
5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Connecting Structure for Flip-Chip Semiconductor Package, Build-Up Layer Material, Sealing Resin Composition, and Circuit Board