Patent Assignment
Reel/Frame 022112/0932
Assignment of Assignor's Interest
Recorded: 2009-01-15
Pages: 5
Assignors
LIU, MING-CHYI
Executed: 2007-03-06
LIU, YUAN-HUNG
Executed: 2007-03-06
SHIAU, GWO-YUH
Executed: 2007-03-06
HSIEH, YUAN-CHIH
Executed: 2007-03-08
LO, CHI-HSIN
Executed: 2007-03-26
TSAI, CHIA-SHIUNG
Executed: 2007-03-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Device with Bonding Pad