IP Library Assignment 022120/0428
Patent Assignment
Reel/Frame 022120/0428

Confirmatory Assignment

Recorded: 2009-01-16 Pages: 3
Assignor
MEHROTRA, VIVEK
Executed: 2009-01-14
Assignee
TELEDYNE LICENSING, LLC
1049 CAMINO DOS RIOS, THOUSAND OAKS, CALIFORNIA, 91360
Covered Property (1)
High Temperature, Stable Sic Device Interconnects and Packages Having Low Thermal Resistance
Patent: 7,659,614 →
Application: 12/116,916 →
Publication: US 2008/0211104
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2009
From: TELEDYNE LICENSING, LLC
To: ASTRIPHEY APPLICATIONS, L.L.C.
Reel/Frame 022392/0310 →
Merger Jan 13, 2016
From: ASTRIPHEY APPLICATIONS L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037509/0695 →