Patent Assignment
Reel/Frame 022135/0506
Assignment of Assignor's Interest
Recorded: 2009-01-21
Pages: 2
Assignee
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
HINTERBERGSTR. 32, CHAM, CH-6330, SWITZERLAND
Covered Property
(1)
Method for Picking Up Semiconductor Chips from a Wafer Table and Method for Mounting Semiconductor Chips on a Substrate