IP Library Assignment 022147/0807
Patent Assignment
Reel/Frame 022147/0807

Assignment of Assignor's Interest

Recorded: 2009-01-23 Pages: 3
Assignors
KANG, IN-GOO
Executed: 2008-11-12
JEON, O-SEOB
Executed: 2008-11-17
SON, JOON-SEO
Executed: 2008-11-04
Assignee
FAIRCHILD KOREA SEMICONDUCTOR, LTD.
82-3, DODANG-DONG, WOMNI-GU, BUCHEON-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Semiconductor Package and Methods of Fabricating the Same
Patent: 8,723,304 →
Application: 12/358,566 →
Publication: US 2009/0194859
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →