Patent Assignment
Reel/Frame 022147/0994
Assignment of Assignor's Interest
Recorded: 2009-01-23
Pages: 2
Assignors
MUTO, AKIRA
Executed: 2008-09-29
KOIKE, NOBUYA
Executed: 2008-09-29
ARAI, KATSUO
Executed: 2008-09-29
FUJIKI, ATSUSHI
Executed: 2008-09-29
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Manufacturing Method of Resin-Sealed Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →