Patent Assignment
Reel/Frame 022152/0119
Assignment of Assignor's Interest
Recorded: 2009-01-24
Pages: 3
Assignors
LEE, JE-HUN
Executed: 2008-04-23
KIM, DO-HYUN
Executed: 2008-04-23
IHN, TAE-HYUNG
Executed: 2008-04-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.