IP Library Assignment 022152/0180
Patent Assignment
Reel/Frame 022152/0180

Assignment of Assignor's Interest

Recorded: 2009-01-22 Pages: 2
Assignor
BOYD, WILLIAM
Executed: 2006-06-23
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVE., BUILDING 4, SUITE 108, COSTA MESA, CALIFORNIA, 92626
Covered Property (1)
Stacked Ball Grid Array Package Module Utilizing One or More Interposer Layers
Patent: 7,709,943 →
Application: 11/350,974 →
Publication: US 2006/0180912
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jan 5, 2007
From: IRVINE SENSORS CORP.
To: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
Reel/Frame 018746/0842 →
Assignment of Assignor's Interest Feb 27, 2007
From: MICHAELS, DANIEL
To: IRVINE SENSORS CORP.
Reel/Frame 018973/0634 →
Assignment of Assignor's Interest Apr 20, 2009
From: IRVINE SENSORS CORPORATION
To: APROLASE DEVELOPMENT CO., LLC
Reel/Frame 022567/0758 →
Release of Security Interest Oct 27, 2009
From: LONGVIEW FUND, L.P.; ALPHA CAPITAL ANSTALT
To: IRVINE SENSORS CORPORATION
Reel/Frame 023430/0702 →