Assignment of Assignor's Interest

Recorded: 2009-01-26 Pages: 2

Assignors

HAMADA, TETSUYA

Executed: 2008-12-12

NISHIYAMA, KOJI

Executed: 2008-12-15

Assignee

SOKUDO CO., LTD.

K-I SHIJO BUILDING, 88 KANKOBOKO-CHO, SHIJODORI-MUROMACHI-HIGASHIIRU, SHIMOGYO-KU, KYOTO, 600-8009, JAPAN

Covered Property (1)

Substrate Processing Apparatus and Substrate Processing Method Using the Same

Patent: 8,015,985 →

Application: 12/349,356 →

Publication: US 2009/0173364

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.