Patent Assignment
Reel/Frame 034150/0849
Change of Name
Recorded: 2014-11-05
Pages: 14
Assignor
SOKUDO CO., LTD.
Executed: 2014-08-07
Assignee
SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
(FORMERLY OF: 88 KANKOBOKO-CHO, SHIJODORI-MUROMACHI-HIGASHIIRU, SHIMOGYO-KU, KYOTO, JAPAN), TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO, JAPAN
Covered Properties
(59)
Coating Solution Applying Method and Apparatus
Patent:
5,843,527 →
Application:
08/662,216 →
Film Dissolution Method of Dissolving Silica-Based Coating Film Formed on Surface of a Substrate
Patent:
5,779,928 →
Application:
08/799,478 →
Coating Solution Applying Method and Apparatus
Patent:
5,989,632 →
Application:
08/953,928 →
Coating Solution Applying Method and Apparatus
Patent:
5,976,620 →
Application:
08/969,273 →
Developing Apparatus and Developing Method
Patent:
5,984,540 →
Application:
08/997,083 →
Coating Solution Applying Method and Apparatus
Patent:
6,440,218 →
Application:
09/450,946 →
Developing Apparatus and Developing Method
Treating Solution Applying Method
Patent:
6,645,880 →
Application:
10/335,302 →
Thermal Processing Apparatus, Thermal Processing Method, and Substrate Processing Apparatus
Edge Exposing Apparatus
Coat/Develop Module with Independent Stations
Developer Endpoint Detection in a Track Lithography System
Coat/Develop Module with Shared Dispense
Cluster Tool Architecture for Processing a Substrate
Bake Plate Having Engageable Thermal Mass
Integrated Thermal Unit Having a Shuttle with Two-Axis Movement
Integrated Thermal Unit Having Laterally Adjacent Bake and Chill Plates on Different Planes
Integrated Thermal Unit Having a Shuttle with a Temperature Controlled Surface
Substrate Processing Apparatus and Substrate Processing Method
Substrate Processing Apparatus and Substrate Processing Method
Substrate Processing Apparatus
Cluster Tool Substrate Throughput Optimization
Method and System to Measure Flow Velocity and Volume
Substrate Processing Apparatus
Substrate Drying Apparatus, Substrate Cleaning Apparatus and Substrate Processing System
Substrate Processing Apparatus
Substrate Processing Apparatus
Methods and Systems for Performing Real-Time Wireless Temperature Measurement for Semiconductor Substrates
Method and Apparatus for Monitoring and Control of Suck Back Level in a Photoresist Dispense System
Methods and Systems for Controlling Critical Dimensions in Track Lithography Tools
Method and System for Controlling Bake Plate Temperature in a Semiconductor Processing Chamber
Integrated Thermal Unit Having a Shuttle with a Temperature Controlled Surface
Integrated Thermal Unit Having a Shuttle with Two-Axis Movement
First Detecting Sheet and First Thermometric System for Detecting and Measuring Temperature of an Object Under Test, Second Detecting Sheet and Second Thermometric System for Detecting and Measuring Temperature of a Dummy Substrate, and Heat Treatment Apparatus Usi
Substrate Processing Apparatus with Integrated Cleaning Unit
Substrate Processing Apparatus with Integrated Top and Edge Cleaning Unit
Substrate Developing Method and Developing Apparatus
Substrate Transport Apparatus and Heat Treatment Apparatus
Bevel Inspection Apparatus for Substrate Processing
Substrate Cleaning Device and Substrate Processing Apparatus Including the Same
Substrate Processing Apparatus with Multi-Speed Drying Having Rinse Liquid Supplier That Moves from Center of Rotated Substrate to Its Periphery and Stops Temporarily So That a Drying Core Can Form
Substrate Processing Apparatus
Temperature Measurement in a Substrate Processing Apparatus
Substrate Cleaning and Processing Apparatus with Magnetically Controlled Spin Chuck Holding Pins
Substrate Treating Apparatus with Inter-Unit Buffers
Multi-Channel Developer System
Substrate Processing Apparatus and Substrate Processing Method Using the Same
Substrate Processing Apparatus and Substrate Processing Method
Apparatus for and Method of Processing Substrate Subjected to Exposure Process
Substrate Processing Apparatus and Substrate Processing Method
Substrate Processing Apparatus
Substrate Processing Apparatus and Substrate Processing Method
Substrate Processing Method
Substrate Processing Apparatus with Heater Element Held by Vacuum
Substrate Processing Apparatus, Substrate Processing System and Inspection/Periphery Exposure Apparatus
Substrate Processing Apparatus and Substrate Processing Method
Substrate Processing Apparatus and Substrate Processing Method
Apparatus for and Method of Heat-Treating Film Formed on Surface of Substrate
Substrate Treating Apparatus with Inter-Unit Buffers
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 11, 1996
From: SANADA, MASAKAZU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 008070/0492 →
Assignment of Assignor's Interest
Feb 12, 1997
From: YAMASHITA, TETSURO; MITSUHASHI, TSUYOSHI; YABE, MANABU
To: DAINIPPON SCREEN MFG. CO., LTD. (CORPORATION-JAPAN)
Reel/Frame 008466/0269 →
Assignment of Assignor's Interest
Oct 20, 1997
From: SANADA, MASAKAZU; MIMASAKA, MASAHIRO
To: DAINIPPON SCREEN MFG. CO., LTD., A CORP. OF JAPAN
Reel/Frame 008961/0039 →
Assignment of Assignor's Interest
Nov 13, 1997
From: SANADA, MASAKAZU; MATSUNAGA, MINOBU
To: DAINIPPON SCREEN MFG. CO., LTD., A CORP. OF JAPAN
Reel/Frame 008884/0913 →
Assignment of Assignor's Interest
Dec 23, 1997
From: MIMASAKA, MASAHIRO; MATSUNAGA, MINOBU; TANAKA, AKIKO; UCHITANI, KOJI
To: DAINIPPON SCREEN MFG. CO., LTD., A CORPORATION OF JAPAN
Reel/Frame 008948/0863 →
Assignment of Assignor's Interest
Nov 29, 1999
From: SANADA, MASAKAZU; NAKANO, KAYOKO; GOTO, SHIGEHIRO; MATSUNAGA, MINOBU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 010428/0203 →
Assignment of Assignor's Interest
Nov 26, 2002
From: SANADA, MASAKAZU; HARUMOTO, MASAHIKO; KOBAYASHI, HIROSHI; MATSUNAGA, MINOBU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 013533/0825 →
Assignment of Assignor's Interest
Dec 31, 2002
From: SHIGEMORI, KAZUHITO; SANADA, MASAKAZU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 013639/0008 →
Assignment of Assignor's Interest
Aug 26, 2004
From: FUKUMOTO, YASUHIRO; MASUDA, MITSUHIRO; AZUMA, TORU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 015745/0080 →
Assignment of Assignor's Interest
Sep 21, 2004
From: AKIYAMA, KAZUYA; KAMEI, KENJI; ONO, KAZUYA
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 015818/0054 →
Assignment of Assignor's Interest
Apr 20, 2005
From: HERCHEN, HARALD
To: APPLIED MATERIALS, INC.
Reel/Frame 016498/0768 →
Assignment of Assignor's Interest
Apr 20, 2005
From: ISHIKAWA, TETSUYA; ROBERTS, RICK
To: APPLIED MATERIALS, INC.
Reel/Frame 016501/0026 →
Assignment of Assignor's Interest
Apr 20, 2005
From: ISHIKAWA, TETSUYA; ROBERTS, RICK
To: APPLIED MATERIALS, INC.
Reel/Frame 016499/0982 →
Assignment of Assignor's Interest
Jul 5, 2005
From: QUACH, DAVID H.; SALINAS, MARTIN JEFF
To: APPLIED MATERIALS, INC.
Reel/Frame 016760/0052 →
Assignment of Assignor's Interest
Jul 5, 2005
From: QUACH, DAVID H.; SALINAS, MARTIN JEFF
To: APPLIED MATERIALS, INC.
Reel/Frame 016721/0596 →
Assignment of Assignor's Interest
Jul 5, 2005
From: QUACH, DAVID H.; ISHIKAWA, TETSUYA
To: APPLIED MATERIALS, INC.
Reel/Frame 016721/0581 →
Assignment of Assignor's Interest
Jul 5, 2005
From: QUACH, DAVID H.; ISHIKAWA, TETSUYA
To: APPLIED MATERIALS, INC.
Reel/Frame 016764/0042 →
Assignment of Assignor's Interest
Aug 5, 2005
From: ISHIKAWA, TETSUYA; ROBERTS, RICK J.; ARMER, HELEN R.; VOLFOVSKI, LEON
To: APPLIED MATERIALS, INC.
Reel/Frame 016361/0270 →
Assignment of Assignor's Interest
Nov 10, 2005
From: KANEYAMA, KOJI; HISAI, AKIHIRO; ASANO, TORU; KOBAYASHI, HIROSHI
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 017234/0434 →
Assignment of Assignor's Interest
Sep 12, 2006
From: DAINIPPON SCREEN MFG. CO., LTD.
To: SOKUDO CO., LTD.
Reel/Frame 018235/0136 →
Assignment of Assignor's Interest
Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018360/0920 →
Assignment of Assignor's Interest
Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018360/0792 →
Assignment of Assignor's Interest
Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018361/0504 →
Assignment of Assignor's Interest
Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018361/0164 →
Assignment of Assignor's Interest
Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018361/0349 →