IP Library Granted Patent US 7,371,022
Granted Patent B2
US 7,371,022 · App. 11/111,156 · Granted May 13, 2008

Developer endpoint detection in a track lithography system

Assignee: Sokudo Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,371,022
App. No.
11/111,156
Granted
May 13, 2008
Kind
B2
Abstract

A method of detecting developer endpoint. The method includes illuminating a device region of a substrate with a first optical beam prior to initiating a development stage of processing and detecting a baseline optical signal reflected from the device region of the substrate. The method also includes illuminating the device region of the substrate with a second optical beam during a development stage of processing and detecting an endpoint optical signal reflected from the device region of the substrate. The method further includes comparing the baseline optical signal to the endpoint optical signal and determining a developer endpoint based on the comparing step.

Claims (16)

1. A method of detecting developer endpoint, the method comprising:

illuminating a device region of a substrate with a first optical beam prior to initiating a development stage of processing;

detecting a baseline optical signal reflected from the device region of the substrate prior to initiating a development stage of processing;

illuminating the device region of the substrate with a second optical beam during a development stage of processing;

detecting an endpoint optical signal reflected from the device region of the substrate during a development stage of processing;

comparing the baseline optical signal to the endpoint optical signal; and

determining a developer endpoint based on the comparing step.

2. The method of claim 1 wherein the step of illuminating the device region of the substrate with the first optical beam is performed while the substrate is coated with water prior to application of develop chemistry.

3. The method of claim 1 wherein the device region is a region comprising active elements.

4. The method of claim 1 wherein the baseline optical signal and the endpoint optical signal comprise reflected and diffracted portions.

5. The method of claim 1 wherein the first optical beam and the second optical beam are collinear and produced by the same laser source.

6. The method of claim 2 wherein the first optical beam is a laser beam having a first wavelength and the second optical beam is a laser beam having a second wavelength.

7. The method of claim 1 wherein detecting a baseline optical signal is performed prior to coating of the substrate with a photoresist layer.

8. The method of claim 1 wherein detecting a baseline optical signal is performed prior to exposing a photoresist layer.

9. The method of claim 1 wherein detecting a baseline optical signal is performed after baking of a photoresist layer.

10. The method of claim 9 wherein detecting a baseline optical signal is performed after coating of the substrate with a layer of deionized water prior to application of a developer solution.

Assignments (3)
CHANGE OF NAME Recorded Nov 5, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 034150/0849 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2006
From: APPLIED MATERIALS, INC.
To: SOKUDO CO., LTD.
Reel/Frame 018361/0164 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2005
From: HERCHEN, HARALD
To: APPLIED MATERIALS, INC.
Reel/Frame 016498/0768 →
Continuity (2)
Provisional Application 6063910900 · Dec 22, 2004
Related Publication 20060132730A1 · Jun 22, 2006