Substrate processing apparatus and substrate processing method
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.
1. A substrate processing method for processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device that applies exposure processing to the substrate by a liquid immersion method, and comprises a first processing unit and a second processing unit, comprising the steps of:
applying a resist liquid to the substrate by said first processing unit to form a resist film on one surface of the substrate;
transporting the substrate, on which the resist film is formed by said first processing unit, to said second processing unit before the exposure processing by said exposure device;
washing the resist film formed on the one surface of the substrate by said first processing unit, by using a washing liquid by said second processing unit before the exposure processing by said exposure device; and
transporting the substrate washed by said second processing unit to said exposure device.
2. The substrate processing method according to claim 1 , wherein
said step of washing the resist film includes the step of supplying the washing liquid to the resist film formed on the one surface of the substrate by said first processing unit.
3. The substrate processing method according to claim 1 , wherein
said step of washing the resist film includes the steps of:
rotating the substrate, on which the resist film is formed by said first processing unit, about a vertical axis while holding the substrate substantially horizontally, and
supplying the washing liquid onto the resist film on the substrate being rotated.
4. The substrate processing method according to claim 1 , further comprising the step of drying the substrate by said second processing unit after washing the resist film by said second processing unit and before transporting the substrate to said exposure device.
5. The substrate processing method according to claim 4 , wherein
said step of drying the substrate includes the step of supplying an inert gas onto the substrate supplied with the washing liquid.
6. The substrate processing method according to claim 5 , wherein
said step of supplying the inert gas includes the steps of:
rotating the substrate supplied with the washing liquid about a vertical axis while holding the substrate substantially horizontally, and
supplying the inert gas onto the substrate being rotated.
7. The substrate processing method according to claim 6 , wherein
said step of supplying the inert gas includes the step of supplying the inert gas so that the washing liquid supplied onto the substrate is removed from the substrate as the washing liquid moves outwardly from the center of the substrate.
8. The substrate processing method according to claim 4 , wherein
said step of supplying the washing liquid includes the step of supplying a fluid mixture containing a washing liquid and a gas onto the substrate from a fluid nozzle of said second processing unit.
9. The substrate processing method according to claim 8 , wherein
said step of drying the substrate includes the step of supplying the inert gas onto the substrate from said fluid nozzle.
10. The substrate processing method according to claim 5 , wherein
said step of drying the substrate further includes the step of supplying a rinse liquid onto the substrate after the supply of the washing liquid and before the supply of the inert gas.
11. The substrate processing method according to claim 10 , wherein
said step of supplying the inert gas includes the step of supplying the inert gas so that the rise liquid supplied onto the substrate is removed from the substrate as the rinse liquid moves outwardly from the center of the substrate.
12. The substrate processing method according to claim 1 , wherein
said substrate processing apparatus further includes a first transport unit having first and second holders, and
said method further comprises the step of transporting the substrate from said exposure device, and wherein
said step of transporting the substrate to said exposure device includes the step of holding and transporting the substrate with said first holder of said first transport unit to said exposure device, and
said step of transporting the substrate from said exposure device includes the step of holding and transporting the substrate from said exposure device with said second holder of said first transport unit.
13. The substrate processing method according to claim 12 , wherein
said step of holding and transporting the substrate from said exposure device with said second holder includes the step of holding and transporting the substrate with said second holder that is provided below said first holder.
14. The substrate processing method according to claim 12 , wherein
said substrate processing apparatus further includes a third processing unit, a second transport unit having third and fourth holders, and a first platform, and
said method further comprises the steps of:
holding and transporting the substrate, on which the resist film is formed, with said third holder of said second transport unit to said third processing unit,
applying given processing to the substrate before the exposure processing, which is transported by said second transport unit, by said third processing unit, and
holding and transporting the substrate after the exposure processing, which is mounted on said first platform, with said fourth holder of said second transport unit, and wherein
said step of transporting the substrate to said second processing unit includes the step of holding and transporting the substrate processed by said third processing unit with said first holder of said first transport unit to said second processing unit,
said step of holding and transporting the substrate with said first holder of said first transport unit to said exposure device includes the step of holding and transporting the substrate with said first holder from said second processing unit to said exposure device, and
said step of holding and transporting the substrate from said exposure device with said second holder includes the step of holding and transporting the substrate from said exposure device with said second holder of said first transport unit to said first platform.
15. The substrate processing method according to claim 14 , wherein
said step of transporting the substrate after the exposure processing by said fourth holder of said second transport unit includes the step of holding and transporting the substrate after the exposure processing, which is mounted on said platform, with said fourth holder that is provided below said third holder.
16. The substrate processing method according to claim 15 , wherein
said step of applying given processing to the substrate by said third processing unit includes the step of subjecting a peripheral portion of the substrate to exposure by said third processing unit.
17. The substrate processing method according to claim 14 , wherein
said substrate processing apparatus further includes a second platform, and
said method further comprises the step of holding and transporting the substrate processed by said third processing unit with said third holder of said second transport unit from said third processing unit to said second platform, and wherein
said step of holding and transporting the substrate processed by said third processing unit with said first holder to said second processing unit includes the step of holding and transporting the substrate mounted on said second platform with said first holder of said first transport unit to said second processing unit.