Coat/develop module with shared dispense
View Patent ↗An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
1. An apparatus for dispensing fluid during semiconductor substrate processing operations, the apparatus comprising:
a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;
a first processing chamber positioned to a first side of the central fluid dispense bank;
a second processing chamber positioned to a second side of the central fluid dispense bank; and
a dispense arm adapted to translate along a longitudinal axis between the central fluid dispense bank, the first processing chamber, and the second processing chamber; wherein the dispense arm is configured to pick up and transfer at least one dispense nozzle, selected from the plurality of dispense nozzles, to a first position in the first processing chamber or to a second position in the second processing chamber.
2. The apparatus of claim 1 wherein the first processing chamber comprises a first spin chuck adapted to hold and rotate a first substrate and the second processing chamber comprises a second spin chuck adapted to hold and rotate a second substrate.
3. The apparatus of claim 2 wherein a support surface of the first spin chuck and a support surface of the second spin chuck are positioned in substantially the same horizontal plane.
4. The apparatus of claim 1 wherein the first processing chamber and the second processing chamber are positioned on opposite sides of the central fluid dispense bank.
5. The apparatus of claim 1 wherein the plurality of dispense nozzles are arrayed in a two-dimensional pattern.
6. The apparatus of claim 5 wherein the two-dimensional pattern comprises a first row of dispense nozzles contained in a first nozzle holder assembly and a second row of dispense nozzles contained in a second nozzle holder assembly.
7. The apparatus of claim 6 wherein the first nozzle holder assembly and the second nozzle holder assembly are aligned substantially parallel to a line connecting a center of the first processing chamber and a center of the second processing chamber.
8. The apparatus of claim 6 wherein the first nozzle holder assembly and the second nozzle holder assembly are aligned substantially perpendicular to a line connecting a center of the first processing chamber and a center of the second processing chamber.
9. The apparatus of claim 1 wherein the central fluid dispense bank shares common plumbing components, thereby reducing a system redundancy.
10. The apparatus of claim 9 wherein the common plumbing components comprise at least one fluid pump.
11. The apparatus of claim 1 wherein the fluid is delivered in the form of vapor, mist, or droplet.
12. An apparatus for dispensing fluid during semiconductor processing operations, the apparatus comprising:
a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;
a first processing chamber positioned to a first side of the central fluid dispense bank;
a first dispense arm adapted to translate along a longitudinal axis between the central fluid dispense bank and the first processing chamber; wherein the first dispense arm is configured to pick up and transfer at least one dispense nozzle, selected from the plurality of dispense nozzles, to a first position in the first processing chamber;
a second processing chamber positioned to a second side of the central fluid dispense bank; and
a second dispense arm adapted to translate along a longitudinal axis between the central fluid dispense bank and the second processing chamber; wherein the second dispense arm is configured to pick up and transfer at least one dispense nozzle, selected from the plurality of dispense nozzles, to a second position in the second processing chamber.
13. The apparatus of claim 12 wherein the first processing chamber comprises a first spin chuck adapted to hold and rotate a first substrate and the second processing chamber comprises a second spin chuck adapted to hold and rotate a second substrate.
14. The apparatus of claim 12 wherein the first processing chamber and the second processing chamber are positioned on opposite sides of the central fluid dispense bank.
15. The apparatus of claim 12 wherein the plurality of dispense nozzles are arrayed in a two-dimensional pattern.
16. The apparatus of claim 12 wherein the central fluid dispense bank is coupled to a fluid source assembly including at least one pump, the fluid source assembly adapted to provide fluid to both the first and second processing chambers.