Apparatus for and method of processing substrate subjected to exposure process
A method of processing a substrate subjected to an exposure process includes the steps of: transporting a substrate subjected to the exposure process to a cleaning processing part and performing a cleaning process in said cleaning processing part on said substrate subjected to the exposure process. The method also includes the steps of transporting said substrate subjected to the cleaning process from said cleaning processing part to a heating processing part and performing a heating process in said heating processing part on said substrate subjected to the cleaning process. A first interprocess time interval between the instant at which the exposure process of a substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant, and a second interprocess time interval between the instant at which the cleaning process of the substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant.
1. A method of processing a plurality of substrates subjected to an exposure process of photolithography, said method comprising the steps of:
performing an exposure process to a substrate in the plurality of substrates with a resist film formed thereon by a resist coating process;
transporting the substrate subjected to the exposure process to a cleaning processing part, wherein transporting the substrate is performed during a transport time;
performing a cleaning process in said cleaning processing part on said substrate subjected to the exposure process, wherein performing the cleaning process is performed during a cleaning time and at least one of the transport time or the cleaning time differs substrate-to-substrate;
transporting said substrate subjected to the cleaning process from said cleaning processing part to a heating processing part;
performing a heating process in said heating processing part on said substrate subjected to the cleaning process; and
performing a development process on said substrate subjected to the heating process,
wherein a first interprocess time interval between the instant at which the exposure process of a substrate is completed and the instant at which the heating process of the substrate is started is a first predetermined constant value substrate-to-substrate, and a second interprocess time interval between the instant at which the cleaning process of the substrate is completed and the instant at which the heating process of the substrate is started is a second predetermined constant value substrate-to-substrate.
2. The method according to claim 1 , wherein
said first interprocess time interval and said second interprocess time interval are made constant by adjusting the instant at which said cleaning processing part completes the cleaning process.
3. The method according to claim 2 , wherein
said instant at which said cleaning processing part completes the cleaning process is adjusted by adjusting a presence time for which the substrate subjected to the exposure process is present in said cleaning processing part.
4. The method according to claim 3 , wherein
said presence time is adjusted by adjusting a waiting time for which the substrate subjected to the exposure process and transported to said cleaning processing part waits until said cleaning process.
5. The method according to claim 3 , wherein
said presence time is adjusted by adjusting a cleaning processing time for which the substrate subjected to the exposure process is subjected to the cleaning process by said cleaning processing part.
6. The method according to claim 1 , wherein
said exposure process is an immersion exposure process.