Substrate treating apparatus with inter-unit buffers
The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
1. A substrate treating apparatus for treating a plurality of substrates comprising:
an indexer section;
a treating section;
one or more receivers; and
one or more buffers;
wherein the treating section has a plurality of stories arranged vertically, each story including:
one or more coating units providing a coating treatment to the plurality of substrates with one or more treating solutions;
one or more heat-treating units providing a heat treatment to the plurality of substrates; and
a first main transport mechanism for transporting the plurality of substrates to and from the one or more coating units and the one or more heat-treating units;
wherein the one or more coating units, the one or more heat-treating units and the first main transport mechanism being in the same arrangement on each respective story in the plurality of stories in plain view;
wherein the one or more receivers are installed on each respective story;
wherein the one or more buffers are installed on each respective story;
wherein the indexer section is arranged to transport the plurality of substrates alternately to each respective story; and
wherein on each story:
the first main transport mechanism is arranged to transport the plurality of substrates received from the indexer section to the one or more coating units and the one or more heat-treating units, and place on the one or more receivers the plurality of substrates having a film formed thereon, and
during a period of an abnormality when the first main transport mechanism cannot place the plurality of substrates on the one or more receivers, the first main transport mechanism temporarily places on the one or more buffers the plurality of substrates having the film formed thereon while a series of treatments including the coating treatment in the one or more coating units and the heat treatment in the one or more heat-treating units is continued according to a predetermined schedule for the plurality of substrates being treated at a time when the abnormality arose.
2. The substrate treating apparatus according to claim 1 , wherein
the one or more coating units are arranged on one side of a transporting space in which the first main transport mechanism is installed; and
the one or more heat-treating units are arranged on the other side of the transporting space.
3. The substrate treating apparatus according to claim 1 , wherein an arrangement of the one or more coating units and the one or more heat-treating units as seen from the first main transport mechanism identical on the respective stories.
4. The substrate treating apparatus according to claim 1 , wherein the first main transport mechanism is arranged to place the plurality of substrates on the one or more receivers in order to transfer the plurality of substrates to a different main transport mechanism.
5. The substrate treating apparatus according to claim 1 , wherein, at the time of the abnormality, the first main transport mechanism cannot place the plurality of substrates on the one or more receivers by a command prohibiting delivery to the one or more receivers.
6. The substrate treating apparatus according to claim 1 , wherein, during a normal operation, the plurality of substrates are placed only on the one or more receivers, and the plurality of substrates are not placed on the one or more buffers.
7. The substrate treating apparatus according to claim 1 , wherein the series of treatments carried out during the period of the abnormality is the same as a series of treatments carried out during a normal operation.
8. The substrate treating apparatus according to claim 1 , wherein the series of treatments carried out during the period of the abnormality includes the coating treatment, the heating treatment and a cooling treatment carried out in the stated order.
9. The substrate treating apparatus according to claim 1 , wherein during a normal operation, the plurality of substrates receive identical treatments on the respective stories.
10. The substrate treating apparatus according to claim 1 , comprising a controller for controlling the first main transport mechanism to place the plurality of substrates on the one or more receivers during a normal operation, and to place the plurality of substrates temporarily on the one or more buffers during the period of the abnormality.
11. A substrate treating apparatus comprising:
an indexer section;
a resist film coating block;
one or more receivers; and
one or more buffers;
wherein the resist film coating block has a plurality of stories arranged vertically, each story including:
one or more coating units providing a coating treatment for a plurality of substrates with one or more treating solutions;
one or more heat-treating units providing a heat treatment for the plurality of substrates; and
a first main transport mechanism for transporting the plurality of substrates to and from the one or more coating units and the one or more heat-treating units;
wherein the one or more coating units, the one or more heat-treating units and the first main transport mechanism being in the same arrangement on each respective story in plain view;
wherein the one or more receivers are installed on each respective story;
wherein the one or more buffers are installed on each respective story;
wherein the indexer section is arranged to transport the plurality of substrates alternately to each story; and
wherein on each story,
the first main transport mechanism is arranged to transport the plurality of substrates received from the indexer section to the one or more coating units and the one or more heat-treating units, and place on the one or more receivers the plurality of substrates having film formed thereon; and
during an abnormal operation when the first main transport mechanism cannot place the plurality of substrates on the one or more receivers, the first main transport mechanism temporarily places on the one or more buffers the plurality of substrates having film formed thereon while a series of treatments including the coating treatment in the one or more coating units and the heat treatment in the one or more heat-treating units is continued according to a predetermined schedule for the plurality substrates being treated when the abnormal operation occurred.
12. The substrate treating apparatus according to claim 11 , wherein
the one or more coating units are arranged on one side of a transporting space in which the first main transport mechanism is installed; and
the one or more heat-treating units are arranged on the other side of the transporting space.
13. The substrate treating apparatus according to claim 11 , wherein an arrangement of the one or more coating units and the one or more heat-treating units as seen from the first main transport mechanism is identical on each respective story.
14. The substrate treating apparatus according to claim 11 , wherein the first main transport mechanism is arranged to place the plurality of substrates on the one or more receivers in order to transfer the plurality of substrates to a different main transport mechanism.
15. The substrate treating apparatus according to claim 11 , wherein during the abnormal operation, the first main transport mechanism cannot place the plurality of substrates on the one or more receivers by a command prohibiting delivery to the one or more receivers.
16. The substrate treating apparatus according to claim 11 , wherein during a normal operation, the plurality of substrates are placed only on the one or more receivers, and the plurality of substrates are not placed on the one or more buffers.
17. The substrate treating apparatus according to claim 11 , wherein the series of treatments carried out during the abnormal operation is the same as a series of treatments carried out during a normal operation.
18. The substrate treating apparatus according to claim 11 , wherein the series of treatments carried out during the abnormal operation includes the coating treatment first, followed by the heating treatment and lastly a cooling treatment.
19. The substrate treating apparatus according to claim 11 , wherein a normal operation, the plurality of substrates receive the same treatments on each respective story.
20. The substrate treating apparatus according to claim 11 , comprising a controller for controlling the first main transport mechanism to place the plurality of substrates on the one or more receivers during a normal operation, and to place the plurality of substrates temporarily on the one or more buffers during the abnormal operation.