IP Library › Assignment 022156/0871
Patent Assignment
Reel/Frame 022156/0871

Assignment of Assignor's Interest

Recorded: 2009-01-26 Pages: 6
Assignors
DING, HAI
Executed: 2008-12-05
WANG, FUCHAO
Executed: 2008-12-05
XIE, ZHIYONG
Executed: 2008-12-05
Assignee
STMICROELECTRONICS, INC.
1310 ELECTRONICS DRIVE, CARROLLTON, TEXAS, 75006
Covered Property (1)
Method to Reduce Metal Fuse Thickness Without Extra Mask
Patent: 9,059,174 →
Application: 12/265,595 →
Publication: US 2010/0109122
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0883 →