IP Library › Assignment 022160/0156
Patent Assignment
Reel/Frame 022160/0156

Assignment of Assignor's Interest

Recorded: 2009-01-27 Pages: 4
Assignors
JOO, SEONG AH
Executed: 2009-01-08
KWAK, CHANG HOON
Executed: 2009-01-08
PARK, NA NA
Executed: 2009-01-08
PARK, IL WOO
Executed: 2009-01-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package and Manufacturing Method Thereof
Patent: 8,445,927 →
Application: 12/360,250 →
Publication: US 2010/0127290
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →